TSV Technology: A Core Pillar of AI Computing Power
To establish a high‑bandwidth data‑transfer backbone for AI chips and sustain continuous gains in computing power, a fundamental underlying technology—TSV (Through‑Silicon Via)—is essential. TSV stands for Through‑Silicon Via, or silicon‑through‑via technology in Chinese. In essence, it creates vertical vias within a silicon wafer and fills them with conductive material, thereby forming a dense, vertically oriented electrical interconnect between the top and bottom surfaces of the wafer. This enables interchip connectivity and is one of the key enabling technologies for 2.5D and 3D packaging.
2026/07/01
From June 10 to 12, 2026, the Liaoning Provincial Qualifying Round of the “Create and Win the Future” 2026 Entrepreneurship Competition was held in Tieling City, co-hosted by the Liaoning Provincial Department of Human Resources and Social Security, the Liaoning Provincial Department of Education, the Liaoning Provincial Department of Science and Technology, the Liaoning Provincial Department of Agriculture and Rural Affairs, and the Liaoning Provincial Department of Veterans Affairs. After three days of intense competition, Pengcheng Micro‑Nano Technology (Shenyang) Co., Ltd. (hereinafter referred to as “Pengcheng Micro‑Nano”) won first prize in the “Scientific and Technological Achievements + Entrepreneurship” track.
2026/06/24
The 7th meeting of the 4th General Assembly and the leadership transition conference of Guangdong Semiconductor Industry Association concluded successfully in Shenzhen on the afternoon of May 16, 2026. Professor Wu Xiangfang, Chairman of Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd. (hereinafter referred to as Pengcheng Semiconductor), was officially appointed as Supervisor of Guangdong Semiconductor Industry Association.
2026/05/19
In early summer, in May, a major event is just around the corner. From May 22 to 24, 2026, the 2026 Conference on Micro‑ and Nano‑Device and System Application Technologies, together with the 19th China Symposium on Micro‑ and Nanoelectronics, will be grandly held in the coastal city of Dalian. Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd. (hereinafter referred to as “Pengcheng Semiconductor”) will attend this conference.
2026/05/16
Did you know? One nanometer equals 10⁻⁹ meters—just one ten-thousandth the diameter of a human hair. The core chips in the smartphones, computers, and 5G devices we use every day harbor a “nanoscale world” even smaller than one ten-thousandth of a hair’s diameter: the realm of advanced-node semiconductors. Within these chips, insulating layers, barrier layers, and conductive films must all be “grown” with nanometer-level precision—this is precisely where high-power impulse magnetron sputtering (HiPIMS) coating technology comes into play.
2026/05/09
The two-day “2026 Second Glass Substrate and Optoelectronics Integration Technology Summit—From TGV Process to CPO Integration” has successfully concluded in Dongguan.
2026/04/29
The “2026 Second Glass Substrate and Optoelectronics Integration Technology Summit—From TGV Process to CPO Integration” will be held from April 27 to April 28 at the Emperor Hotel in Songshan Lake, Dongguan.
2026/04/24
Technology empowers industries, and intelligent innovation leads the transformation of instrumentation. The 19th China Annual Conference on Scientific Instrument Development (ACCSI 2026), co-hosted by Instrument Information Network and the Management Committee of Zhongguancun Science City, will be grandly inaugurated in Beijing from April 22 to 24, 2026.
2026/04/20
“The Coating Black Technology” Hidden in Medical Imaging
When it comes to medical imaging, most people are familiar with procedures such as CT and PET-CT scans. During operation, the performance of these devices—particularly the clarity and sensitivity of the resulting images—is largely determined by a nanoscale precision thin film coating applied to their core components. This coating, in turn, relies on an unsung “coating black technology”: magnetron sputtering.
2026/04/04
From March 22 to 23, 2026, the 2026 China Advanced Semiconductor Packaging and Testing Conference (China International Semiconductor Packaging and Testing Conference) was successfully held at the GreenTree Holiday Hotel in Pudong, Shanghai. This premier industry event, centered on the development of the semiconductor packaging and testing sector, brought together leading companies across the entire value chain as well as distinguished experts and scholars to jointly explore innovative advancements in advanced packaging and testing technologies and pathways for industrial upgrading.
2026/03/28
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