“The Coating Black Technology” Hidden in Medical Imaging

When it comes to medical imaging, most people are familiar with procedures such as CT and PET-CT scans. During operation, the performance of these devices—particularly the clarity and sensitivity of the resulting images—is largely determined by a nanoscale precision thin film coating applied to their core components. This coating, in turn, relies on an unsung “coating black technology”: magnetron sputtering.

Carrying forward our accolades, we pioneer a science-and-tech-driven future! Pengcheng Semiconductor has been honored with the 2026 China Semiconductor Packaging and Testing Equipment Best Brand Enterprise Award.

From March 22 to 23, 2026, the 2026 China Advanced Semiconductor Packaging and Testing Conference (China International Semiconductor Packaging and Testing Conference) was successfully held at the GreenTree Holiday Hotel in Pudong, Shanghai. This premier industry event, centered on the development of the semiconductor packaging and testing sector, brought together leading companies across the entire value chain as well as distinguished experts and scholars to jointly explore innovative advancements in advanced packaging and testing technologies and pathways for industrial upgrading.

Pengcheng Semiconductor Leads the Future: Explosive Growth of TGV and TSV Technologies on the Horizon

With the rapid development of the semiconductor industry, especially in the field of chip interconnect technologies, through-glass vias (TGV) technology is increasingly becoming a key driver of growth. In the near future, this technology is expected to usher in unprecedented growth opportunities in both the global and Chinese markets. According to the latest market research data, China has already become the world’s largest market for TGV technology applications.

Application of Magnetron Sputtering Technology in the Preparation of Core Thin Films for Key Components in Medical Imaging

In the ongoing evolution of modern medical imaging technology, magnetron sputtering has become a core process in the field of thin-film fabrication and is widely used in the manufacturing of critical components for medical imaging.

Pengcheng Semiconductor Achieves a New Breakthrough in Magnetron Sputtering Technology, Boosting the Localization of High-End Vacuum Coating Equipment.

Shenzhen—Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd. (hereinafter referred to as "Pengcheng Semiconductor"), which has been deeply engaged in the fields of advanced semiconductor packaging and micro- and nano-manufacturing, recently announced a significant technological breakthrough in its independently developed high-vacuum magnetron sputtering coating equipment. The equipment has successfully achieved high-density via plating with a depth-to-diameter ratio exceeding 10:1 in TGV (Through Glass Via) coating processes, injecting new momentum into the development of domestically produced vacuum coating equipment in the field of three-dimensional integration.

Principles, Classification, and Applications of Physical Vapor Deposition (PVD) Technology

Physical Vapor Deposition (PVD) is an advanced surface engineering technology that, under vacuum conditions, uses physical methods to convert a target material into gaseous atoms, molecules, or ions, which then deposit onto the substrate surface to form a thin film. Since its development in the early 20th century, PVD technology has become a crucial technique in modern additive manufacturing and functional coating applications, owing to its advantages such as environmental friendliness, controllable costs, minimal consumable usage, dense and uniform film properties, and strong adhesion between the film and substrate. PVD enables the on-demand preparation of functional films with properties including wear resistance, corrosion resistance, conductivity, insulation, piezoelectricity, and magnetism, and is widely used across various industries, including mechanical, electronic, construction, and medical sectors.

The TGV glass through-hole technology has achieved a significant breakthrough, and its application prospects continue to expand.

Recently, TGV (Through Glass Via) technology has made significant strides in the fields of materials processing and micro- and nano-manufacturing, drawing considerable attention from the semiconductor, advanced packaging, and emerging electronic device industries. With its outstanding electrical performance, high-frequency characteristics, and three-dimensional integration capabilities, TGV is emerging as one of the key technologies for next-generation high-density interconnects.

Application of TGV Glass Through-Hole Technology in Magnetron Sputtering

As an advanced micro- and nano-fabrication technique, TGV glass via-hole technology has demonstrated tremendous application potential in the field of magnetron sputtering. By precisely fabricating vias on glass substrates, this technology not only enables vertical interconnections for three-dimensional circuits but also significantly enhances the integration and performance of electronic devices.

Diamond: Possessing potential that surpasses existing semiconductor materials, with broader application prospects in the future.

Diamond is used as a semiconductor material—and some scholars even hail it as the “ultimate semiconductor material” and the “ultimate room-temperature quantum material”—owing to its unique physical and chemical properties. Diamond is an ultra-wide-bandgap semiconductor that boasts exceptional electrical, optical, mechanical, thermal, and chemical characteristics. These properties give diamond broad application prospects in numerous fields.

Pengcheng Semiconductor: The Strategy, Tactics, and Survival Guide of a High-Tech Enterprise

The 15th China International Nanotechnology Industry Expo (referred to as "Nanobio"), held under much anticipation, successfully came to a close. This year's event featured one keynote speech, 15 parallel forums, and hosted 605 cutting-edge presentations. Additionally, it included an innovation and entrepreneurship competition, along with three supply-and-demand matchmaking sessions. The expo brought together over 150 nationally recognized talents and more than 500 top experts from leading universities, research institutions, and corporate organizations both domestically and internationally. With an exhibition area spanning 25,000 square meters, the event attracted over 350 of the world's premier companies and institutions, showcasing more than 2,400 of the latest nanotechnology products and innovative applications globally. Over the three-day period, the expo drew nearly 27,500 attendees in total, making it the largest-ever edition in terms of scale and cementing its growing influence on the global stage.