Micro nano technology and high-end precision manufacturing

Create greater value for customers

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Semiconductor and general semiconductor fields

Manufacturers of R & D, design and production of semiconductor materials, engineering and equipment

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Industrial/research grade thin film deposition equipment

Semiconductor and general semiconductor fields research, design, and production manufacturer specializing in devices, micro-nano materials and devices, as well as advanced precision manufacturing technology

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Development and production of micro-and nano-crystalline diamond films
Large-size diamond polycrystalline wafers for high-power devices,
Heat sink of high frequency device and high power laser

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Advanced semiconductor material supplier based on autonomous equipment

PECVD plasma enhanced chemical vapor deposition equipment is mainly used in
Thin film growth of silicon nitride and silicon oxide in clean vacuum environment

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Product

Total trip system

The whole equipment is a cluster structure, which is composed of photoelectric conversion film deposition system, MAMS electronic stripping system, exhaust packaging system, getter material vacuum coating system and overall degassing system. Can realize the overall automatic coordination operation, can also be independent operation of each system, do not interfere with each other, can be set between the system interlock. 316 material manufacturing, reserved a number of flange interface.

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Production-type TGV/TSV/TMV high-vacuum magnetron sputtering coating machine

Production-grade TGV/TSV/TMV high-vacuum magnetron sputtering coating system (Sputter-2000W series): This equipment is used for depositing metal seed layers on glass substrates and ceramic substrates, enabling high-density through-holes and blind vias with a depth-to-diameter ratio exceeding 10:1.

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Ultra-High Vacuum High-Energy Pulsed Magnetron Sputtering Coating System (HITSemi-UHV-HIPIMS)

Ultra-high vacuum, high-energy pulsed magnetron sputtering coating equipment utilizes nanoscale and atomic‑level manufacturing technologies in an ultra‑clean environment to grow high‑purity, high‑quality thin films. One application scenario is the growth of GaN single crystal thin films and the realization of processes for preparing GaN‑based dilute magnetic semiconductor molecular structure materials.

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MBE molecular beam epitaxy equipment

Molecular Beam Epitaxy (MBE) thin-film growth equipment—Molecular Beam Epitaxy MBE—enables epitaxial growth on certain substrates, allowing for the fabrication of molecular self-assembled structures, superlattices, quantum wells, one-dimensional nanowires, and more. It can also be used for process verification and the growth and fabrication of epitaxial wafers for both second-generation and third-generation semiconductors. During thin-film epitaxial growth, Molecular Beam Epitaxy equipment provides an ultra-high vacuum environment, enabling epitaxial growth under ideal conditions. This eliminates various interfering factors during film growth, resulting in high-precision thin films with exceptional accuracy.

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About Us

Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd.

By the Harbin Institute of Technology (Shenzhen) and has many years of practical experience in the team of engineers to jointly initiate the creation.


Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd. was co-founded by Harbin Institute of Technology, Shenzhen (HIT Shenzhen) and a team of engineers with years of practical industry experience. Positioned at the intersection of technology, market and industry, the company adheres to innovation and sustainable development. It is committed to breaking through industrial technical bottlenecks and tackling localization challenges, so as to advance the independent controllability of the industrial chain. Pengcheng Micro-Nano Technology (Shenyang) Co., Ltd., a wholly-owned subsidiary of Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd., serves as the core R&D and manufacturing base for semiconductor and general semiconductor processes and equipment.

Further understanding
2021 Year

Company establishment time

60 +

technology patent

30 Year

technology accumulation

200 +

Customer Service

Laboratory and R & D Center

Relying on the complete experimental platform and test analysis platform of Harbin Institute of Technology (Shenzhen), it provides support for R & D and production.

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News

The 27th CIOE China Optoelectronics Expo is set to open, as we join Shenzhen Semiconductor in embarking on a new journey in micro- and nano-manufacturing.

2026-09-03

From September 9 to 11, 2026, the 27th CIOE China Optics Expo will open with great fanfare! Pengcheng Semiconductor will showcase its self-developed vacuum thin-film equipment—covering magnetron sputtering, electron-beam evaporation, HFCVD diamond deposition—and comprehensive process solutions at the Shenzhen Bao’an Convention & Exhibition Center. Focusing on advanced packaging, precision optics, and optoelectronic manufacturing, we warmly invite industry peers to visit, engage in discussions, and explore new opportunities together!

Pengcheng Semiconductor Exhibition Highlights | The 8th Precision Ceramics Industry Chain Exhibition

2026-08-29

From August 26 to 28, 2026, the three-day 8th Precision Ceramics Industry Chain Exhibition successfully concluded at Hall 7 of the Shenzhen International Convention and Exhibition Center (Bao’an New Venue). Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd. (hereinafter referred to as “Pengcheng Semiconductor”) showcased diamond‑based thermal‑dissipation wafers along with its core coating equipment—PVD coating systems and CVD coating systems—at Booth H20.

Pengcheng Semiconductor invites you to join the 8th Precision Ceramics Industry Chain Exhibition and attend this premier event showcasing cutting-edge packaging technologies.

2026-08-19

From August 26 to 28, 2026, the 8th Precision Ceramics Industry Chain Exhibition will grandly open in Hall 7 of the Shenzhen International Convention and Exhibition Center (Bao’an New Venue). Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd. (hereinafter referred to as “Pengcheng Semiconductor”) will be showcasing at this event and participating in the concurrently held 4th Glass Substrate and Advanced Packaging Industry Chain Summit Forum. We cordially invite customers and industry peers to attend, engage in discussions, and jointly explore new opportunities for technological advancement in the sector.

Pengcheng Micro-Nano was awarded third prize in the national finals of the “Innovate for the Future” Entrepreneurship Competition.

2026-08-11

Recently, the national finals of the “Create and Win the Future” entrepreneurship competition, co-hosted by the Ministry of Human Resources and Social Security and the People’s Government of Anhui Province, concluded in Hefei. Pengcheng Micro‑Nano Technology (Shenyang) Co., Ltd. (hereinafter referred to as “Pengcheng Micro‑Nano”) won third prize in the “Scientific and Technological Achievements + Entrepreneurship Track” category of the national finals, thanks to its project on a tunnel‑type continuous high‑vacuum magnetron sputtering coating and encapsulation system. The company has thus successfully completed the full competition journey, advancing from the provincial qualifiers to the national stage.