Micro nano technology and high-end precision manufacturing

Create greater value for customers

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Semiconductor and general semiconductor fields

Manufacturers of R & D, design and production of semiconductor materials, engineering and equipment

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Industrial/research grade thin film deposition equipment

Semiconductor and general semiconductor fields research, design, and production manufacturer specializing in devices, micro-nano materials and devices, as well as advanced precision manufacturing technology

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Development and production of micro-and nano-crystalline diamond films
Large-size diamond polycrystalline wafers for high-power devices,
Heat sink of high frequency device and high power laser

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Advanced semiconductor material supplier based on autonomous equipment

PECVD plasma enhanced chemical vapor deposition equipment is mainly used in
Thin film growth of silicon nitride and silicon oxide in clean vacuum environment

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Product

Total trip system

The whole equipment is a cluster structure, which is composed of photoelectric conversion film deposition system, MAMS electronic stripping system, exhaust packaging system, getter material vacuum coating system and overall degassing system. Can realize the overall automatic coordination operation, can also be independent operation of each system, do not interfere with each other, can be set between the system interlock. 316 material manufacturing, reserved a number of flange interface.

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Production-type TGV/TSV/TMV high-vacuum magnetron sputtering coating machine

Production-grade TGV/TSV/TMV high-vacuum magnetron sputtering coating system (Sputter-2000W series): This equipment is used for depositing metal seed layers on glass substrates and ceramic substrates, enabling high-density through-holes and blind vias with a depth-to-diameter ratio exceeding 10:1.

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Ultra-High Vacuum High-Energy Pulsed Magnetron Sputtering Coating System (HITSemi-UHV-HIPIMS)

Ultra-high vacuum, high-energy pulsed magnetron sputtering coating equipment utilizes nanoscale and atomic‑level manufacturing technologies in an ultra‑clean environment to grow high‑purity, high‑quality thin films. One application scenario is the growth of GaN single crystal thin films and the realization of processes for preparing GaN‑based dilute magnetic semiconductor molecular structure materials.

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MBE molecular beam epitaxy equipment

Molecular Beam Epitaxy (MBE) thin-film growth equipment—Molecular Beam Epitaxy MBE—enables epitaxial growth on certain substrates, allowing for the fabrication of molecular self-assembled structures, superlattices, quantum wells, one-dimensional nanowires, and more. It can also be used for process verification and the growth and fabrication of epitaxial wafers for both second-generation and third-generation semiconductors. During thin-film epitaxial growth, Molecular Beam Epitaxy equipment provides an ultra-high vacuum environment, enabling epitaxial growth under ideal conditions. This eliminates various interfering factors during film growth, resulting in high-precision thin films with exceptional accuracy.

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About Us

Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd.

By the Harbin Institute of Technology (Shenzhen) and has many years of practical experience in the team of engineers to jointly initiate the creation.


Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd. was co-founded by Harbin Institute of Technology, Shenzhen (HIT Shenzhen) and a team of engineers with years of practical industry experience. Positioned at the intersection of technology, market and industry, the company adheres to innovation and sustainable development. It is committed to breaking through industrial technical bottlenecks and tackling localization challenges, so as to advance the independent controllability of the industrial chain. Pengcheng Micro-Nano Technology (Shenyang) Co., Ltd., a wholly-owned subsidiary of Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd., serves as the core R&D and manufacturing base for semiconductor and general semiconductor processes and equipment.

Further understanding
2021 Year

Company establishment time

60 +

technology patent

30 Year

technology accumulation

200 +

Customer Service

Laboratory and R & D Center

Relying on the complete experimental platform and test analysis platform of Harbin Institute of Technology (Shenzhen), it provides support for R & D and production.

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News

TSV Technology: A Core Pillar of AI Computing Power

2026-07-01

To establish a high‑bandwidth data‑transfer backbone for AI chips and sustain continuous gains in computing power, a fundamental underlying technology—TSV (Through‑Silicon Via)—is essential. TSV stands for Through‑Silicon Via, or silicon‑through‑via technology in Chinese. In essence, it creates vertical vias within a silicon wafer and fills them with conductive material, thereby forming a dense, vertically oriented electrical interconnect between the top and bottom surfaces of the wafer. This enables interchip connectivity and is one of the key enabling technologies for 2.5D and 3D packaging.

Warm congratulations to Pengcheng Micro‑Nano on winning the first prize in the Liaoning Province preliminary round of the “Innovate for the Future” 2026 Entrepreneurship Competition.

2026-06-24

From June 10 to 12, 2026, the Liaoning Provincial Qualifying Round of the “Create and Win the Future” 2026 Entrepreneurship Competition was held in Tieling City, co-hosted by the Liaoning Provincial Department of Human Resources and Social Security, the Liaoning Provincial Department of Education, the Liaoning Provincial Department of Science and Technology, the Liaoning Provincial Department of Agriculture and Rural Affairs, and the Liaoning Provincial Department of Veterans Affairs. After three days of intense competition, Pengcheng Micro‑Nano Technology (Shenyang) Co., Ltd. (hereinafter referred to as “Pengcheng Micro‑Nano”) won first prize in the “Scientific and Technological Achievements + Entrepreneurship” track.

Professor Wu Xiangfang, Chairman of Pengcheng Semiconductor, has been appointed as a supervisor of the Guangdong Semiconductor Industry Association.

2026-05-19

The 7th meeting of the 4th General Assembly and the leadership transition conference of Guangdong Semiconductor Industry Association concluded successfully in Shenzhen on the afternoon of May 16, 2026. Professor Wu Xiangfang, Chairman of Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd. (hereinafter referred to as Pengcheng Semiconductor), was officially appointed as Supervisor of Guangdong Semiconductor Industry Association.

Dalian, let’s meet—join Pengcheng Semiconductor at the 2026 Conference on Micro- and Nano‑Device and System Application Technologies.

2026-05-16

In early summer, in May, a major event is just around the corner. From May 22 to 24, 2026, the 2026 Conference on Micro‑ and Nano‑Device and System Application Technologies, together with the 19th China Symposium on Micro‑ and Nanoelectronics, will be grandly held in the coastal city of Dalian. Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd. (hereinafter referred to as “Pengcheng Semiconductor”) will attend this conference.