Carrying forward our accolades, we pioneer a science-and-tech-driven future! Pengcheng Semiconductor has been honored with the 2026 China Semiconductor Packaging and Testing Equipment Best Brand Enterprise Award.
Release time:
2026-03-28
From March 22 to 23, 2026, the 2026 China Advanced Semiconductor Packaging and Testing Conference (China International Semiconductor Packaging and Testing Conference) was successfully held at the GreenTree Holiday Hotel in Pudong, Shanghai. This premier industry event, centered on the development of the semiconductor packaging and testing sector, brought together leading companies across the entire value chain as well as distinguished experts and scholars to jointly explore innovative advancements in advanced packaging and testing technologies and pathways for industrial upgrading.
Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd. (hereinafter referred to as “ Pengcheng Semiconductor ”) was invited to attend and, thanks to its robust technological expertise in the field of packaging and testing equipment, continuous innovative breakthroughs, and strong industry reputation, was awarded the 2026 China Semiconductor Packaging and Testing Equipment Best Brand Enterprise Award, making it one of the highlight companies at this conference.
At this conference, Pengcheng Semiconductor made a stunning appearance with a range of independently developed core products and cutting-edge technologies, including: PVD coating equipment 、 Molecular Beam Epitaxy (MBE) 、 PECVD plasma-enhanced chemical vapor deposition equipment and so on. Among them, the independently developed Production-grade TGV/TSV/TMV high-vacuum magnetron sputtering coating system It drew the attention of the attendees, as it is used for the electroplating of metal seed layers in high-density through-holes and blind vias on glass and ceramic substrates. Depth-to-diameter ratio > 10:1 。
Production-grade TGV/TSV/TMV high-vacuum magnetron sputtering coating system
In addition, during this conference, the company’s technical experts engaged in in-depth exchanges with industry peers on such topics as advanced packaging and testing technologies and the localization and upgrading of equipment. As a closed-door industry event, this conference applies stringent selection criteria to evaluate the technological capabilities and industry influence of participating companies. Pengcheng Semiconductor’s invitation to attend and its subsequent receipt of the Best Brand Enterprise Award not only reflect the high level of recognition from the conference organizing committee and industry experts for the company’s technological strength, product branding, and quality, but also serve as an authoritative endorsement of its brand influence in the semiconductor packaging and testing equipment sector.
Future Prospects
Currently, driven by the explosive growth of industries such as artificial intelligence, high-performance computing, and 5G communications, the advanced packaging and testing sector is experiencing a period of robust prosperity, with its cutting-edge technologies emerging as a critical pathway for sustaining Moore’s Law and enhancing chip system performance. At the same time, China’s semiconductor packaging and testing industry is at an unprecedented juncture—facing both strategic opportunities and the formidable challenge of achieving domestic R&D and localization of core technologies. Against this backdrop, Pengcheng Semiconductor remains steadfast in its development philosophy of “innovation-led, sustainable growth, and independent controllability.” The company continuously increases its investment in R&D, persistently tackles key technical challenges in packaging and testing equipment, and steadily refines its product portfolio and service capabilities. Its design center and manufacturing base for semiconductor and broader semiconductor processes and equipment have achieved independent production of core components and end-to-end R&D and manufacturing of complete systems, thereby establishing a closed-loop, full-industry-chain model encompassing R&D, manufacturing, and services. This enables the company to provide customers with one-stop solutions that span the entire value chain—from equipment R&D and production to process prototyping, upgrades, and system modernization.
Winning the 2026 China Semiconductor Packaging and Testing Equipment Best Brand Enterprise Award marks a significant milestone in Pengcheng Semiconductor’s journey and serves as a fresh starting point. Moving forward, Pengcheng Semiconductor will remain committed to its core development strategy of technological innovation and sustainable growth, deepening its expertise in the semiconductor packaging and testing equipment sector. The company will continue to drive breakthroughs in the localization of high-end equipment and advance technological upgrades, strengthen collaboration across the entire industry value chain, and deliver higher-quality products and more professional services to empower the development of the semiconductor packaging and testing industry—thereby contributing greater technological strength to the high-quality development of China’s semiconductor industry.
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