The global MBE market is steadily growing, with China's Pengcheng Semiconductor breaking through technological monopolies

In 2021, the global market size of Molecular Beam Epitaxy (MBE) systems was approximately 550 million RMB. Looking ahead to 2028, this figure is projected to climb to 960 million RMB, signifying a consistent expansion of the market at a compound annual growth rate (CAGR) of 8.3% between 2022 and 2028. MBE systems play a crucial role in semiconductor and basic materials research. Major consumers include countries with well-established industrial systems such as Europe, the United States, Japan, and China, which collectively account for over 80% of the global market share.

Forwarding Science and Technology News | Enriching Forms to Promote Services, Accurate Services to Promote Innovation

May 15, 2025, marks the 19th annual "Government Affairs Open Day" in the province. Centering on the theme of "Deepening Government Affairs Openness to Support the Decisive Battle and Victory," the Shenyang Municipal Science and Technology Innovation Service Center leveraged this opportunity, combining publicity of Shenyang's science and technology innovation policies with the needs of assisting enterprises, to conduct a special research and visit activity. This research focused on Pengcheng Micronanotechnology (Shenyang) Co., Ltd., aiming to publicize the achievements in the construction of Shenyang's science and technology innovation platforms, the sharing of resources from science and technology infrastructure platforms, and the results of the implementation of innovation voucher policies. The goal is to promote the collaborative development of the Shenyang Municipal Science and Technology Intermediary Service Alliance, further optimize the business environment, and support enterprise innovation breakthroughs.

Thin film deposition equipment

Thin film deposition equipment classification Thin film deposition refers to the deposition of thin film materials to be processed on substrates such as silicon wafers. The deposited thin film materials are mainly non-metals such as silicon dioxide, silicon nitride, and polysilicon, as well as metals such as copper. The deposited films can be amorphous, polycrystalline, or single crystal.

Exhibition Invitation | Pengcheng Semiconductor sincerely invites you to attend the 7th Global Semiconductor Industry (Chongqing) Expo

The 7th Global Semiconductor Industry (Chongqing) Expo will be held at the Chongqing International Expo Center from May 8th to 10th, 2025. Themed "New Era • Creating a Smart Future", the expo will cover 40,000 square meters, feature 800 exhibitors, and attract 35,000 professional visitors.

Pengcheng Semiconductor has been awarded the title of National High-tech Enterprise, leading a new journey in nano and atomic manufacturing technology.

In the current era of rapid technological development, the semiconductor industry, as the cornerstone of modern information technology, is continuously driving innovation and transformation in various fields. Recently, Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd. successfully obtained the national high-tech enterprise certification due to its outstanding technological innovation capabilities and significant contributions in the semiconductor field. This honor is not only a high recognition of Pengcheng Semiconductor's past efforts but also marks the authoritative certification of its leading position in the field of nano and atomic manufacturing technology.

Semiconductor manufacturing and advanced packaging continue to heat up

Thanks to strong policy support, cyclical changes in the industry, innovation-driven growth, and the accelerated advancement of domestic substitution, the localization rate has significantly improved across multiple segments, from IC design to wafer manufacturing, packaging testing, and equipment materials. This marks a steady progress of China's semiconductor industry towards self-control.

Pengcheng Semiconductor showcases TGV/TSV/TMV technology at the Munich Shanghai Optical Expo.

The Munich Shanghai Optical Expo is known as the annual event for the laser, optics, and optoelectronics industry in Asia. Since its first event in Shanghai in 2006, its scale and influence have been increasing day by day, and it has become an important communication platform for the global optoelectronics industry. The Munich Shanghai Optical Expo will be held from March 20-22, 2025, at the Shanghai New International Expo Center (No. 2345 Longyang Road, Pudong New District, Shanghai). At that time, Pengcheng Semiconductor will showcase cutting-edge thin film deposition equipment and technology solutions at booth E4-4631. The PVD/CVD technology based on nano and atomic manufacturing is used for high-quality thin film preparation. For example, using magnetron sputtering technology for single crystal film preparation and applying magnetron sputtering to molecular beam epitaxy's beam source, etc. The exhibits cover popular application areas such as micro-nano optics, acoustics, and medical fields. This Munich Shanghai Optical Expo will bring cutting-edge technologies and products to everyone, and we sincerely invite all new and old customers to take the time to visit our booth for discussions and exchanges!

Pengcheng's semiconductor glass substrate TGV technology supports advanced packaging.

In the field of advanced packaging, both interposers in 2.5D packaging and TSVs in 3D packaging are essential. Recently, many people have heard the term Through Glass Via (TGV). The potential of TGV is immense, and it may become a common feature in advanced packaging technology in the future. This article will briefly describe the applications and development trends of Through Glass Via (TGV) in advanced packaging, as well as an overview of the process.

Production-type TGV/TSV

The production-type TGV/TSV high vacuum magnetron sputtering coating machine is used for coating high-density through holes and blind holes on glass substrates and ceramic substrates, with a depth-to-diameter ratio greater than 10:1. For example, it is used for the substrate coating process of Cu/Ti microstructures and the deposition capability of Au/TiW transmission line dual system films, providing support for the enhancement of micro-system integration density.

Congratulations! We warmly congratulate Pengcheng Semiconductor on obtaining the national invention patent certificate.

Warm congratulations to Pengcheng Semiconductor for the invention patent "A Plug Valve and Vertical Double Chamber Hot Wire CVD System" being authorized by the National Intellectual Property Administration, and for receiving the national invention patent certificate on December 10, 2024.