“The Coating Black Technology” Hidden in Medical Imaging


Release time:

2026-04-04

When it comes to medical imaging, most people are familiar with procedures such as CT and PET-CT scans. During operation, the performance of these devices—particularly the clarity and sensitivity of the resulting images—is largely determined by a nanoscale precision thin film coating applied to their core components. This coating, in turn, relies on an unsung “coating black technology”: magnetron sputtering.

When it comes to medical imaging, most people are familiar with procedures such as CT and PET-CT scans. During operation, the performance of these devices hinges on a nanoscale precision thin film coating applied to their core components, which directly determines image clarity and sensitivity. And this thin film would be impossible without an invisible “coating black technology”— Magnetron sputtering Technology

Magnetron sputtering is a type of physical vapor deposition. Simply put, it involves accelerating ions with a magnetic field in a vacuum environment, causing them to uniformly bombard the target material and eject target atoms. This process deposits a high-quality thin film with excellent adhesion, high density, and outstanding uniformity on the surfaces of critical components in medical imaging equipment.

As a silent artisan in the fabrication of high-end thin films, magnetron sputtering has emerged as the core driving force behind the dramatic performance enhancements of medical imaging devices. For instance, in the field of medical optical lenses, multi-layer dielectric coatings deposited via magnetron sputtering can significantly boost light transmittance, thereby improving the diagnostic capabilities of medical imaging equipment.

Pengcheng Semiconductor Leveraging our independently developed high-vacuum magnetron sputtering equipment and processes, we precisely empower the entire medical imaging industry chain with nanothin films.

Production-Grade TGV/TSV/TMV High-Vacuum Magnetron Sputtering Coating System (Sputter-2000W Series) This equipment is used for depositing a metal seed layer on high-density through-holes and blind holes in glass and ceramic substrates. Depth-to-diameter ratio > 10:1 For example, the capability to deposit Cu/Ti microstructures in the substrate coating process and Au/TiW dual-system films for interconnects provides critical support for increasing the integration density of microsystems.

Production-Grade High-Vacuum Magnetron Sputtering/Ion-Assisted/Multi-Arc Hybrid Coating System (PVD-1000S Series) This equipment is widely used for the deposition of hard, wear-resistant coatings on the surfaces of milling cutters, drill bits, bearings, gears, lenses, and other components. It is a PVD system that integrates multiple process technologies, including workpiece surface treatment, ion cleaning, particulate control, magnetron sputtering, ion-assisted deposition, and reactive sputter deposition.

Production-Grade High-Vacuum Magnetron Sputtering and Ion-Assisted Composite Coating System (PVD-1000B Series) This equipment employs magnetron sputtering, ion-assisted deposition, and reactive sputtering to deposit a variety of thin-film materials on the workpiece surface. It is an integrated PVD system that combines multiple processes, including surface treatment, ion cleaning, particulate control, magnetron sputtering, ion-assisted coating, and reactive sputter deposition.

As medical imaging technology continues to evolve toward higher resolution, lower radiation doses, and greater intelligence, the performance requirements for thin-film devices will steadily increase. Pengcheng Semiconductor will continue to leverage its technological advantages stemming from industry–university–research collaboration, stay abreast of the latest industry trends, and provide independently developed, high-quality thin-film deposition equipment to support the upgrade of domestically produced medical devices.

News Center

Professor Wu Xiangfang, Chairman of Pengcheng Semiconductor, has been appointed as a supervisor of the Guangdong Semiconductor Industry Association.

The 7th meeting of the 4th General Assembly and the leadership transition conference of Guangdong Semiconductor Industry Association concluded successfully in Shenzhen on the afternoon of May 16, 2026. Professor Wu Xiangfang, Chairman of Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd. (hereinafter referred to as Pengcheng Semiconductor), was officially appointed as Supervisor of Guangdong Semiconductor Industry Association.

Dalian, let’s meet—join Pengcheng Semiconductor at the 2026 Conference on Micro- and Nano‑Device and System Application Technologies.

In early summer, in May, a major event is just around the corner. From May 22 to 24, 2026, the 2026 Conference on Micro‑ and Nano‑Device and System Application Technologies, together with the 19th China Symposium on Micro‑ and Nanoelectronics, will be grandly held in the coastal city of Dalian. Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd. (hereinafter referred to as “Pengcheng Semiconductor”) will attend this conference.

High-Energy Pulsed Magnetron Sputtering Coating: The Indigenous Key to the Nanoscale World of Semiconductors

Did you know? One nanometer equals 10⁻⁹ meters—just one ten-thousandth the diameter of a human hair. The core chips in the smartphones, computers, and 5G devices we use every day harbor a “nanoscale world” even smaller than one ten-thousandth of a hair’s diameter: the realm of advanced-node semiconductors. Within these chips, insulating layers, barrier layers, and conductive films must all be “grown” with nanometer-level precision—this is precisely where high-power impulse magnetron sputtering (HiPIMS) coating technology comes into play.

The Curtain Falls, Yet the Momentum Persists—Pioneering a Bright Future | Pengcheng Semiconductor Successfully Concludes the 2026 Second Glass Substrate and Optoelectronics Integration Technology Summit

The two-day “2026 Second Glass Substrate and Optoelectronics Integration Technology Summit—From TGV Process to CPO Integration” has successfully concluded in Dongguan.

Pengcheng Semiconductor will be exhibiting at the “2026 Second Glass Substrate and Optoelectronics Integration Technology Summit—From TGV Process to CPO Integration.”

The “2026 Second Glass Substrate and Optoelectronics Integration Technology Summit—From TGV Process to CPO Integration” will be held from April 27 to April 28 at the Emperor Hotel in Songshan Lake, Dongguan.