“The Coating Black Technology” Hidden in Medical Imaging


Release time:

2026-04-04

When it comes to medical imaging, most people are familiar with procedures such as CT and PET-CT scans. During operation, the performance of these devices—particularly the clarity and sensitivity of the resulting images—is largely determined by a nanoscale precision thin film coating applied to their core components. This coating, in turn, relies on an unsung “coating black technology”: magnetron sputtering.

When it comes to medical imaging, most people are familiar with procedures such as CT and PET-CT scans. During operation, the performance of these devices hinges on a nanoscale precision thin film coating applied to their core components, which directly determines image clarity and sensitivity. And this thin film would be impossible without an invisible “coating black technology”— Magnetron sputtering Technology

Magnetron sputtering is a type of physical vapor deposition. Simply put, it involves accelerating ions with a magnetic field in a vacuum environment, causing them to uniformly bombard the target material and eject target atoms. This process deposits a high-quality thin film with excellent adhesion, high density, and outstanding uniformity on the surfaces of critical components in medical imaging equipment.

As a silent artisan in the fabrication of high-end thin films, magnetron sputtering has emerged as the core driving force behind the dramatic performance enhancements of medical imaging devices. For instance, in the field of medical optical lenses, multi-layer dielectric coatings deposited via magnetron sputtering can significantly boost light transmittance, thereby improving the diagnostic capabilities of medical imaging equipment.

Pengcheng Semiconductor Leveraging our independently developed high-vacuum magnetron sputtering equipment and processes, we precisely empower the entire medical imaging industry chain with nanothin films.

Production-Grade TGV/TSV/TMV High-Vacuum Magnetron Sputtering Coating System (Sputter-2000W Series) This equipment is used for depositing a metal seed layer on high-density through-holes and blind holes in glass and ceramic substrates. Depth-to-diameter ratio > 10:1 For example, the capability to deposit Cu/Ti microstructures in the substrate coating process and Au/TiW dual-system films for interconnects provides critical support for increasing the integration density of microsystems.

Production-Grade High-Vacuum Magnetron Sputtering/Ion-Assisted/Multi-Arc Hybrid Coating System (PVD-1000S Series) This equipment is widely used for the deposition of hard, wear-resistant coatings on the surfaces of milling cutters, drill bits, bearings, gears, lenses, and other components. It is a PVD system that integrates multiple process technologies, including workpiece surface treatment, ion cleaning, particulate control, magnetron sputtering, ion-assisted deposition, and reactive sputter deposition.

Production-Grade High-Vacuum Magnetron Sputtering and Ion-Assisted Composite Coating System (PVD-1000B Series) This equipment employs magnetron sputtering, ion-assisted deposition, and reactive sputtering to deposit a variety of thin-film materials on the workpiece surface. It is an integrated PVD system that combines multiple processes, including surface treatment, ion cleaning, particulate control, magnetron sputtering, ion-assisted coating, and reactive sputter deposition.

As medical imaging technology continues to evolve toward higher resolution, lower radiation doses, and greater intelligence, the performance requirements for thin-film devices will steadily increase. Pengcheng Semiconductor will continue to leverage its technological advantages stemming from industry–university–research collaboration, stay abreast of the latest industry trends, and provide independently developed, high-quality thin-film deposition equipment to support the upgrade of domestically produced medical devices.

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“The Coating Black Technology” Hidden in Medical Imaging

When it comes to medical imaging, most people are familiar with procedures such as CT and PET-CT scans. During operation, the performance of these devices—particularly the clarity and sensitivity of the resulting images—is largely determined by a nanoscale precision thin film coating applied to their core components. This coating, in turn, relies on an unsung “coating black technology”: magnetron sputtering.

Carrying forward our accolades, we pioneer a science-and-tech-driven future! Pengcheng Semiconductor has been honored with the 2026 China Semiconductor Packaging and Testing Equipment Best Brand Enterprise Award.

From March 22 to 23, 2026, the 2026 China Advanced Semiconductor Packaging and Testing Conference (China International Semiconductor Packaging and Testing Conference) was successfully held at the GreenTree Holiday Hotel in Pudong, Shanghai. This premier industry event, centered on the development of the semiconductor packaging and testing sector, brought together leading companies across the entire value chain as well as distinguished experts and scholars to jointly explore innovative advancements in advanced packaging and testing technologies and pathways for industrial upgrading.

Pengcheng Semiconductor Leads the Future: Explosive Growth of TGV and TSV Technologies on the Horizon

With the rapid development of the semiconductor industry, especially in the field of chip interconnect technologies, through-glass vias (TGV) technology is increasingly becoming a key driver of growth. In the near future, this technology is expected to usher in unprecedented growth opportunities in both the global and Chinese markets. According to the latest market research data, China has already become the world’s largest market for TGV technology applications.

Application of Magnetron Sputtering Technology in the Preparation of Core Thin Films for Key Components in Medical Imaging

In the ongoing evolution of modern medical imaging technology, magnetron sputtering has become a core process in the field of thin-film fabrication and is widely used in the manufacturing of critical components for medical imaging.

Pengcheng Semiconductor Achieves a New Breakthrough in Magnetron Sputtering Technology, Boosting the Localization of High-End Vacuum Coating Equipment.

Shenzhen—Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd. (hereinafter referred to as "Pengcheng Semiconductor"), which has been deeply engaged in the fields of advanced semiconductor packaging and micro- and nano-manufacturing, recently announced a significant technological breakthrough in its independently developed high-vacuum magnetron sputtering coating equipment. The equipment has successfully achieved high-density via plating with a depth-to-diameter ratio exceeding 10:1 in TGV (Through Glass Via) coating processes, injecting new momentum into the development of domestically produced vacuum coating equipment in the field of three-dimensional integration.