Pengcheng Semiconductor Achieves a New Breakthrough in Magnetron Sputtering Technology, Boosting the Localization of High-End Vacuum Coating Equipment.

Shenzhen—Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd. (hereinafter referred to as "Pengcheng Semiconductor"), which has been deeply engaged in the fields of advanced semiconductor packaging and micro- and nano-manufacturing, recently announced a significant technological breakthrough in its independently developed high-vacuum magnetron sputtering coating equipment. The equipment has successfully achieved high-density via plating with a depth-to-diameter ratio exceeding 10:1 in TGV (Through Glass Via) coating processes, injecting new momentum into the development of domestically produced vacuum coating equipment in the field of three-dimensional integration.

Principles, Classification, and Applications of Physical Vapor Deposition (PVD) Technology

Physical Vapor Deposition (PVD) is an advanced surface engineering technology that, under vacuum conditions, uses physical methods to convert a target material into gaseous atoms, molecules, or ions, which then deposit onto the substrate surface to form a thin film. Since its development in the early 20th century, PVD technology has become a crucial technique in modern additive manufacturing and functional coating applications, owing to its advantages such as environmental friendliness, controllable costs, minimal consumable usage, dense and uniform film properties, and strong adhesion between the film and substrate. PVD enables the on-demand preparation of functional films with properties including wear resistance, corrosion resistance, conductivity, insulation, piezoelectricity, and magnetism, and is widely used across various industries, including mechanical, electronic, construction, and medical sectors.

The TGV glass through-hole technology has achieved a significant breakthrough, and its application prospects continue to expand.

Recently, TGV (Through Glass Via) technology has made significant strides in the fields of materials processing and micro- and nano-manufacturing, drawing considerable attention from the semiconductor, advanced packaging, and emerging electronic device industries. With its outstanding electrical performance, high-frequency characteristics, and three-dimensional integration capabilities, TGV is emerging as one of the key technologies for next-generation high-density interconnects.

Application of TGV Glass Through-Hole Technology in Magnetron Sputtering

As an advanced micro- and nano-fabrication technique, TGV glass via-hole technology has demonstrated tremendous application potential in the field of magnetron sputtering. By precisely fabricating vias on glass substrates, this technology not only enables vertical interconnections for three-dimensional circuits but also significantly enhances the integration and performance of electronic devices.

Diamond: Possessing potential that surpasses existing semiconductor materials, with broader application prospects in the future.

Diamond is used as a semiconductor material—and some scholars even hail it as the “ultimate semiconductor material” and the “ultimate room-temperature quantum material”—owing to its unique physical and chemical properties. Diamond is an ultra-wide-bandgap semiconductor that boasts exceptional electrical, optical, mechanical, thermal, and chemical characteristics. These properties give diamond broad application prospects in numerous fields.

Pengcheng Semiconductor: The Strategy, Tactics, and Survival Guide of a High-Tech Enterprise

The 15th China International Nanotechnology Industry Expo (referred to as "Nanobio"), held under much anticipation, successfully came to a close. This year's event featured one keynote speech, 15 parallel forums, and hosted 605 cutting-edge presentations. Additionally, it included an innovation and entrepreneurship competition, along with three supply-and-demand matchmaking sessions. The expo brought together over 150 nationally recognized talents and more than 500 top experts from leading universities, research institutions, and corporate organizations both domestically and internationally. With an exhibition area spanning 25,000 square meters, the event attracted over 350 of the world's premier companies and institutions, showcasing more than 2,400 of the latest nanotechnology products and innovative applications globally. Over the three-day period, the expo drew nearly 27,500 attendees in total, making it the largest-ever edition in terms of scale and cementing its growing influence on the global stage.

Pengcheng Semiconductor Debuts at the High-End Professional Exhibition on "Optoelectronics + Semiconductors"—Shenzhen's 26th China International Optoelectronic Exposition

When the "light-speed" innovation of optoelectronics meets the "subtle" breakthroughs in semiconductors, two premier, high-end professional exhibitions leading global industry collaboration are set to make a cross-industry debut, shining brightly in Shenzhen. On September 10, the 26th China International Optoelectronic Expo (CIOE China Optics Expo) and SEMI-e Shenzhen International Semiconductor Exhibition, along with the 2025 Integrated Circuit Industry Innovation Expo, unveiled themselves at the Shenzhen International Convention & Exhibition Center. With an exhibition space exceeding 300,000 square meters, attracting over 5,000 exhibitors and expected to draw 160,000 professional visitors, these events have established a new benchmark for collaborative development between the optoelectronics and semiconductor industries, injecting powerful momentum into the global tech sector as it breaks through technological barriers and sparks fresh waves of innovation.

Pengcheng Semiconductor Hard Coating and Film Deposition Solutions: Empowering High-End Manufacturing Performance

In the arena of high-end manufacturing, every technological breakthrough is like a shining new star, illuminating the path forward for the industry. Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd. (hereinafter referred to as: Pengcheng Semiconductor), as an innovation pioneer in the industry, with its excellent hard coating and film solutions, is injecting strong impetus into the improvement of high-end manufacturing performance, becoming a trusted partner for many enterprises.

Exhibition Invitation丨Pengcheng Semiconductor sincerely invites you to attend the 2025 China Materials Congress!

The 2025 China Materials Congress will be held at the Xiamen International Convention and Exhibition Center in Fujian Province from July 5th to 8th, 2025. The congress is expected to attract 30,000 attendees and will feature 115 domestic and international sub-conferences covering five major themes: energy materials, environmental materials, advanced structural materials, functional materials, and materials design, preparation, and evaluation. A number of special forums will also be held, including a youth forum, a special new materials forum, a materials education forum, and a materials journal forum. In addition, an international new materials scientific research instrument and equipment exhibition will be held concurrently.

Pengcheng Semiconductor Showcases Focus on 'Bottleneck' and 'Cutting-Edge' Fields - 2025 China Materials Conference

“China Materials Congress 2025”: As a national academic brand conference in the field of new materials, it is oriented towards major national needs, bringing together the most authoritative experts and scholars and national strategic scientific and technological forces, focusing on key breakthroughs in “stuck neck” areas and “cutting-edge competition” areas, promoting high-end academic discussions, solving major common problems in industry development and major difficulties in the advancement of emerging industries, seizing the academic commanding heights of global new material development, forming a systematic national strategic layout, and building a solid material foundation and guarantee for promoting the construction of China's new productive forces.