Shenzhen CVD diamond film technology [Typhoon News]]

CVD diamond film technology has been applied to many fields because of its excellent performance and wide application prospect. In the future, with the progress of technology and the continuous optimization of performance, CVD diamond film has a broader application prospect in the following fields:

PVD vacuum coating equipment industry analysis

In 2024, the total size of the global PVD vacuum coating equipment industry is about $2.2 billion, and it is expected that this figure will double to $4.7 billion by 2024. PVD vacuum coating technology is formed by non-metallic substances with vacuum temperature and charged ion collision technology to form thick film, which has the advantages of high polymerization, strong adhesion, high transparency and good corrosion resistance.

Market status of vacuum coating industry

Vacuum coating is a branch of surface treatment technology, which refers to the process of converting metal, non-metal or compound materials (film materials) into gaseous or plasma state by physical or chemical means in order to reduce the interference of impurities. and deposited on the surface of glass, metal, ceramic, plastic or organic materials and other solid materials (referred to as substrates, substrates or substrates) to form a thin film.

What is chemical vapor deposition (CVD) technology?

Chemical vapor deposition (CVD) technology is used to prepare high-purity, high-performance solid thin films of the main technology, is committed to integrated circuits, semiconductor lighting, MEMS, power semiconductors, compound semiconductors, new energy photovoltaic and other fields to provide various types of CVD equipment to meet the needs of customers a variety of manufacturing processes.

Revival and Development of Vacuum Sputtering Coating

Sputtering is a phenomenon in which the surface of a solid (hereinafter referred to as a target) is bombarded with energy-charged particles (usually positive ions of an inert gas), thereby causing atoms (or molecules) on the surface of the target to escape from it. This phenomenon is Grove (Grove) in 1842 in the experimental study of cathode corrosion, the cathode material was migrated to the vacuum tube wall and found. The use of this sputtering method to deposit thin films on substrates was developed in 1877. However, there are a series of problems in the initial stage of depositing a thin film by this method, such as a low sputtering rate, a slow film-forming speed, and the necessity of setting a high pressure on the apparatus and passing an inert gas. As a result, slow development is nearly eliminated. Only in the chemically active precious metal refractory metals, media and compounds and other materials have been a small amount of application.

What is the working principle of ion coating equipment

Ion coating equipment originated from the theory put forward by D.M.Maiox in the 1950 s, and corresponding experiments began at that time. Until 1971, Chamber et al. published electron beam ion plating technology. The reactive evaporation (ARE) technology was pointed out in the 1972 Bunshah report, which produced ultra-hard film types such as TC and TN. Also in 1972, Smith and Moley adopted hollow cathode technology in the coating process. In the 1980 s, ion plating in China finally reached the level of industrial application, and coating processes such as vacuum multi-arc ion plating and arc discharge ion plating appeared one after another.

Pengcheng Semiconductor invites you to attend China Materials Conference-July 8-11 Guangzhou

Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd. (referred to as: Pengcheng Semiconductor), which focuses on the R & D, design and production of micro-nano materials (including semiconductor materials), micro-nano manufacturing process and micro-nano equipment, is a platform for displaying innovative technology products and applications with the help of China Materials Conference, pengcheng Semiconductor will exhibit its carefully developed HFCVD hot filament chemical vapor deposition system solutions, scientific research/production magnetron sputtering (PVD vacuum coating) solutions, molecular beam epitaxial film growth equipment MBE, PECVD plasma enhanced chemical vapor deposition solutions, etc. Guests from home and abroad are eagerly looking forward to visiting booth 2F62 of Guangzhou Baiyun International Conference Center Phase I to jointly explore new paths for the development of material design and preparation, seek new opportunities for the industry, and jointly write a new chapter in the high-quality development of the industry.

Pengcheng Semiconductor invites you to attend the SEMI-e 2024 Shenzhen International Semiconductor Exhibition from June 26 to 28 at Shenzhen International Convention and Exhibition Center (Bao 'an)

The 6th Shenzhen International Semiconductor Exhibition SEMl-e2024 will be held in Shenzhen International Convention and Exhibition Center (Baoan) from June 26 to 28. As an influential and representative industry event in the semiconductor field, this exhibition will bring together more than 800 exhibitors to display chip design, wafer manufacturing and packaging, semiconductor special equipment and parts, advanced materials, third-generation semiconductors/IGBTs, The semiconductor industry chain dominated by automotive semiconductors will build a new ecology of semiconductor industry exchange and integration.

Invitation | 2024 National Advanced Coating and Film Technology Application Development Conference (6.18-19 Suzhou)

Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd. was jointly initiated by Harbin Institute of Technology (Shenzhen) and a team of engineers with many years of practical experience. Based on the intersection of market frontier, industry frontier and technology frontier, the company seeks innovation guidance and sustainable development, solves the pain points of the industry and the problem of localization, and strives for the independent control of the industrial chain.

Thin film deposition process and equipment

Thin film deposition is to deposit a layer of nano-scale thin film on the substrate, and then cooperate with the repeated etching and polishing processes to make a lot of stacked conductive or insulating layers, and each layer has a designed circuit pattern. Thus, the semiconductor element and the wiring are integrated into a chip having a complicated structure.