Principles, Classification, and Applications of Physical Vapor Deposition (PVD) Technology
Release time:
2026-01-13
Physical Vapor Deposition (PVD) is an advanced surface engineering technology that, under vacuum conditions, uses physical methods to convert a target material into gaseous atoms, molecules, or ions, which then deposit onto the substrate surface to form a thin film. Since its development in the early 20th century, PVD technology has become a crucial technique in modern additive manufacturing and functional coating applications, owing to its advantages such as environmental friendliness, controllable costs, minimal consumable usage, dense and uniform film properties, and strong adhesion between the film and substrate.
PVD enables the on-demand preparation of functional films with properties including wear resistance, corrosion resistance, conductivity, insulation, piezoelectricity, and magnetism, and is widely used across various industries, including mechanical, electronic, construction, and medical sectors.
I. Overview
Physical Vapor Deposition Physical Vapor Deposition, PVD ) is an advanced surface engineering technology that, under vacuum conditions, uses physical methods to convert a target material into gaseous atoms, molecules, or ions and deposits them onto the substrate surface to form a thin film. Since its development in the early 20th century, PVD technology has been favored for its... Environmentally friendly, cost-controllable, requires minimal consumables, features a dense and uniform film layer, and exhibits strong adhesion between the film and substrate. With its advantages, it has become an important technology in the fields of modern additive manufacturing and functional coatings.
PVD can be used to prepare materials with specific requirements. Wear-resistant, corrosion-resistant, conductive, insulating, piezoelectric, magnetic Functional films with such properties are widely used in various industries, including mechanical, electronic, construction, and medical sectors.
II. Basic Process Principle
The film-forming process of PVD typically involves the following three core steps:
The entire process is carried out under high-vacuum or medium-vacuum conditions, effectively avoiding interference from gaseous impurities and ensuring the purity and performance of the film layer.
III. Main Types and Principles of PVD Technologies
1. Vacuum Evaporation Coating Vacuum Evaporation)
The principle is the simplest: the target material is vaporized by heating and then condenses onto the substrate to form a film. Depending on the heat source, it can be categorized as follows:
2. Vacuum sputtering coating (Sputtering Deposition)
In a vacuum environment, high-energy ions (typically Ar⁺) are used to bombard the target surface, causing target atoms to be “sputtered” off due to momentum transfer and subsequently deposited onto the substrate.
3. Arc Ion Plating (AIP)
Based on Cathodic arc discharge Principle: Under low vacuum conditions (approximately 10⁻² Pa), an arc is initiated on the surface of a conductive target material using an arc-starting needle. The instantaneous high temperature (>10⁴ K) causes local vaporization and intense ionization of the target material, forming a metal plasma. Subsequently, under the influence of a bias voltage, the plasma deposits onto the substrate.
Features ：
4. Electron Beam Physical Vapor Deposition (EB-PVD)
By combining the advantages of electron-beam evaporation and directional deposition, a high-energy electron beam is used to precisely heat the target material, allowing the vapor to grow epitaxially on a low-temperature substrate, typically forming... Columnar crystal structure 。
Advantage ：
IV. Main Application Areas
1. Tool and Mold Surface Enhancement
2. Architectural decorative materials
3. Preparation of Special Functional Films
4. Thin Films for Electronic and Medical Devices
5. Corrosion-resistant protective coating
V. Summary
Physical vapor deposition technology, thanks to its High precision, multi-functionality, environmentally friendly Its characteristics have become one of the indispensable core processes in modern advanced manufacturing. As the demand for high-performance materials continues to grow, PVD technology is moving toward... High ionization rate, nanostructure modulation, and integrated composite processing Continuing to develop in various directions, it will play an even greater role in cutting-edge fields such as new energy, microelectronics, and biomedicine in the future.
News Center
The 7th meeting of the 4th General Assembly and the leadership transition conference of Guangdong Semiconductor Industry Association concluded successfully in Shenzhen on the afternoon of May 16, 2026. Professor Wu Xiangfang, Chairman of Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd. (hereinafter referred to as Pengcheng Semiconductor), was officially appointed as Supervisor of Guangdong Semiconductor Industry Association.
In early summer, in May, a major event is just around the corner. From May 22 to 24, 2026, the 2026 Conference on Micro‑ and Nano‑Device and System Application Technologies, together with the 19th China Symposium on Micro‑ and Nanoelectronics, will be grandly held in the coastal city of Dalian. Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd. (hereinafter referred to as “Pengcheng Semiconductor”) will attend this conference.
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The two-day “2026 Second Glass Substrate and Optoelectronics Integration Technology Summit—From TGV Process to CPO Integration” has successfully concluded in Dongguan.
The “2026 Second Glass Substrate and Optoelectronics Integration Technology Summit—From TGV Process to CPO Integration” will be held from April 27 to April 28 at the Emperor Hotel in Songshan Lake, Dongguan.
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