Shenzhen—Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd. (hereinafter referred to as “Pengcheng Semiconductor”), which has been deeply engaged in the fields of advanced semiconductor packaging and micro- and nano-manufacturing, recently announced that its independently developed... High-vacuum magnetron sputtering coating equipment A major technological breakthrough has been achieved in the TGV (Through-Glass Via) coating process, successfully enabling high-density via coating with a depth-to-diameter ratio exceeding 10:1. This breakthrough injects new momentum into the development of domestically produced vacuum coating equipment in the field of three-dimensional integration.

Leading the industry with core technology

As a leading domestic supplier of semiconductor process equipment, Pengcheng Semiconductor has leveraged the research strength of Harbin Institute of Technology (Shenzhen) and the industry experience of its seasoned engineering team to establish a comprehensive product portfolio in the field of magnetron sputtering technology. Its flagship product— Production-grade TGV/TSV/TMV high-vacuum magnetron sputtering coating system (Sputter-2000W series) Specifically designed for high-density through-hole and blind-hole plating on glass and ceramic substrates, this technology enables precise fabrication of dual-layer films such as Cu/Ti microstructures and Au/TiW interconnects, significantly enhancing the integration density of microsystems.

This technology represents a high-end application of PVD (Physical Vapor Deposition) processes. In a vacuum environment, high-energy particles bombard a target material, thereby depositing a dense, high-purity thin film onto the substrate surface. Pengcheng Semiconductor Equipment features programmable automated control and boasts outstanding advantages such as excellent film uniformity, superior repeatability, and strong adhesion. It can stably produce a wide variety of material systems, including metal, alloy, compound, semiconductor, ceramic, and dielectric composite films.

Vacuum technology builds the cornerstone of quality.

“Vacuum technology is the core prerequisite for ensuring film quality,” emphasized the head of Pengcheng Semiconductor Technology. The company’s equipment provides an ultra-high vacuum environment during epitaxial film growth, effectively eliminating interfering factors during the deposition process and guaranteeing the production of high-precision films with ideal characteristics. By optimizing key technologies such as vacuum acquisition techniques, control of gas molecule movement paths, and vacuum magnetohydrodynamic sealing, Pengcheng Semiconductor has not only improved its pumping efficiency but also significantly extended the continuous operating time of its equipment, thereby greatly boosting production efficiency.

Wide application prospects

Thin films prepared by magnetron sputtering exhibit outstanding performance in electrical, optical, thermal, and mechanical properties, and are widely used in fields such as integrated circuits (ICs), power devices, semiconductor lighting LEDs, advanced packaging, medical devices, new energy technologies, and aerospace. In particular, in the TGV glass through-hole technology, magnetron-sputtered coatings enable vertical interconnections of three-dimensional circuits, significantly enhancing the integration density and high-frequency performance of electronic devices.

As the semiconductor industry moves toward higher density and three-dimensional integration, the demand for deep-hole plating technology is becoming increasingly urgent. Pengcheng Semiconductor’s vacuum coating equipment is emerging as a crucial domestically produced alternative that addresses this critical bottleneck.

Continuous Innovation and Market Expansion

Pengcheng Semiconductor not only focuses on technological R&D but also actively promotes industrialization. The company has obtained ISO9001 quality management system certification, marking the implementation of standardized management across its entire value chain—from production and research to sales. Recently, the company participated in major industry events such as the National Semiconductor Conference and the China New Materials Industry Development Conference, showcasing its latest vacuum coating equipment solutions. Additionally, Pengcheng Semiconductor has established deep collaborations with research institutions both at home and abroad.

“It is our mission to ensure that every user can access domestically developed, independently researched and designed vacuum coating equipment,” said the head of Pengcheng Semiconductor. “In the future, we will continue to increase our investment in core areas such as magnetron sputtering and vacuum technology, providing solid equipment support for the high-quality development of China’s semiconductor industry.”

About Pengcheng Semiconductor

Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd. was co-founded by Harbin Institute of Technology (Shenzhen) and a team of seasoned engineers. The company is dedicated to micro- and nano-technologies and high-end precision manufacturing. Its specific application areas include the R&D and design, production and manufacturing, process technology services, and upgrade and retrofitting of equipment for semiconductor and broad-spectrum semiconductor materials, processes, and equipment. The company can also provide customers with process R&D and prototyping services.