Application of TGV Glass Through-Hole Technology in Magnetron Sputtering
Release time:
2026-01-05
TGV glass through-hole As an advanced micro- and nano-fabrication technique, the technology... Magnetron sputtering This technology demonstrates tremendous application potential in various fields. By precisely fabricating through-holes on glass substrates, it not only enables vertical interconnections for three-dimensional circuits but also significantly enhances the integration and performance of electronic devices. During magnetron sputtering, TGV glass vias serve as conductive channels, guiding sputtered particles to deposit accurately in designated areas and forming high-quality, high-precision thin-film layers. This unique feature gives TGV glass via technology a distinct advantage in the fabrication of high-performance sensors, microelectromechanical systems (MEMS), and advanced optical components. Moreover, this technology boasts excellent thermal and chemical stability, ensuring long-term reliable operation even under harsh environmental conditions, thereby further expanding the scope of magnetron sputtering applications. As microelectronics technology continues to advance, the integration of TGV glass via technology with magnetron sputtering will become increasingly close. This synergy holds great promise for playing a pivotal role in cutting-edge fields such as integrated circuit packaging, 5G communications, and the Internet of Things, driving related industries toward higher levels of development.
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