Pengcheng Semiconductor Leads the Future: Explosive Growth of TGV and TSV Technologies on the Horizon
Release time:
2026-02-03
As Semiconductor The industry is experiencing rapid development, particularly in the field of chip interconnection technologies, throughout. Through-Glass Via (TGV) Technology It is increasingly becoming a core growth driver. In the near future, this technology is expected to usher in unprecedented growth opportunities in both the global and Chinese markets. According to the latest market research data, China has already become the world’s largest market for TGV technology applications.
At the forefront of semiconductor manufacturing, Pengcheng Semiconductor Leveraging its leading technological capabilities and keen market insights, the company has successfully developed a production-oriented... High-vacuum magnetron sputtering coating equipment It is widely used in the fabrication of TGVs, TSVs, and even TMVs. This not only marks a significant breakthrough for China in semiconductor manufacturing technology but also showcases China’s leading position in the field of semiconductor interconnects to the world.
As an emerging technology in the field of semiconductor interconnects, Through-Glass Via (TGV) technology is of paramount importance. This technology not only enhances chip integration but also offers new solutions for improving the performance and reducing the cost of semiconductor devices. With continuous technological advancements and rapid market growth, TGV technology is poised for explosive growth between 2026 and 2030. The Chinese market is leading the global trend, accounting for over 35% of the global application market.
Production-grade TGV/TSV/TMV high-vacuum magnetron sputtering coating equipment
Meanwhile, Pengcheng Semiconductor’s high-vacuum magnetron sputtering coating equipment has become an industry benchmark thanks to its outstanding performance and highly efficient production capabilities. This equipment not only meets the stringent requirements for high vacuum levels but also boasts excellent film uniformity and strong adhesion. Its wide range of applications has enabled it to secure a prominent position in the semiconductor manufacturing sector.
Industry experts generally believe that Pengcheng Semiconductor’s innovation will bring revolutionary changes to the entire industry. Against the backdrop of increasingly fierce competition in the global semiconductor market, Chinese companies’ breakthroughs in core technologies have undoubtedly injected powerful momentum into the rise of China’s semiconductor industry. In the future, as TGV technology is widely adopted and the market experiences rapid growth, Pengcheng Semiconductor is poised to continue leading the trend of industry development.
In summary, Chinese semiconductor manufacturers—represented by Pengcheng Semiconductor—are developing at an unprecedented pace and playing an increasingly important role on the global stage. We believe that between 2026 and 2030, the explosive growth of TGV technology will bring unprecedented development opportunities to the semiconductor industry, both in China and worldwide.
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