Principle of Vacuum Coating Machine Equipment


Release time:

2024-11-28

The vacuum coating machine is an advanced surface treatment technology device that can form one or more layers of thin films on the surface of various materials, imparting new properties to the substrate, such as improved wear resistance, corrosion resistance, and optical performance. The working principle of the vacuum coating machine is mainly based on physical vapor deposition (PVD) technology, involving various physical processes such as vacuum technology, thermal evaporation, and sputtering.

Vacuum Coating Machineis an advanced surface treatment technology device that can form one or more layers of thin films on the surface of various materials, giving the substrate new properties such as improved wear resistance, corrosion resistance, and optical performance. The working principle of the vacuum coating machine is mainly based on physical vapor deposition (PVD) technology, involving various physical processes such as vacuum technology, thermal evaporation, and sputtering.

In these processes, the working principle of the vacuum coating machine can be summarized in the following key steps:

1. Creation of a vacuum environment: The film material (such as metals, alloys, compounds, etc.) is released by heating and evaporating or sputtering, then freely flies in the vacuum chamber and finally deposits on the substrate surface. This step is crucial because air molecules can collide with the evaporated film molecules, leading to rough and dull crystallinity. A high vacuum environment can significantly reduce such collisions, making the crystallinity dense and bright.

2. Release of film material: In a vacuum environment, the film material is released by heating and evaporating or sputtering.

Evaporation process: Heating the evaporation source causes the film material to evaporate into gaseous molecules. Sputtering process: High-energy particles (such as ions) bombard the target material, causing target atoms or molecules to be ejected.

3. Deposition of molecules: The evaporated or sputtered film molecules freely fly in the vacuum chamber and finally deposit on the substrate surface. During the deposition process, the molecules undergo stages of adsorption, diffusion, and condensation, ultimately forming one or more layers of thin film.

4. Cooling after coating completion: After the coating is completed, the vacuum coating machine needs to be cooled to solidify the film on the substrate. This process helps enhance the bonding strength between the film and the substrate, improving the stability and durability of the film.

Magnetron sputtering technology can significantly improve sputtering efficiency and film quality. It uses a magnetic field to control the motion trajectory of the sputtered target atoms or molecules, allowing for more uniform deposition on the substrate surface.

There are various types of vacuum coating machines, such asevaporation coating machines,sputtering coating machines, ion coating machines, etc., each type has its unique characteristics and applicable scope. For example, evaporation coating machines are suitable for coating metal films and alloy films; sputtering coating machines are suitable for coating high hardness and high wear resistance films; ion coating machines can form films with special properties on the substrate surface.

Vacuum coating technology has wide application value in industrial production. It can provide high-quality surface treatment technology for various industrial products, improving their wear resistance, corrosion resistance, optical performance, etc. At the same time, vacuum coating technology can also provide high-quality protective films and reflective films for optical devices, electronic devices, etc., thereby extending the service life of products and enhancing their performance.

In summary, the working principle of the vacuum coating machine involves multiple complex physical processes and technical links. By precisely controlling these processes, high-quality and high-efficiency coating production can be achieved, providing advanced surface treatment technology for various industrial applications.

Equipment Manufacturer-Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd.

 

News Center

TSV Technology: A Core Pillar of AI Computing Power

To establish a high‑bandwidth data‑transfer backbone for AI chips and sustain continuous gains in computing power, a fundamental underlying technology—TSV (Through‑Silicon Via)—is essential. TSV stands for Through‑Silicon Via, or silicon‑through‑via technology in Chinese. In essence, it creates vertical vias within a silicon wafer and fills them with conductive material, thereby forming a dense, vertically oriented electrical interconnect between the top and bottom surfaces of the wafer. This enables interchip connectivity and is one of the key enabling technologies for 2.5D and 3D packaging.

Warm congratulations to Pengcheng Micro‑Nano on winning the first prize in the Liaoning Province preliminary round of the “Innovate for the Future” 2026 Entrepreneurship Competition.

From June 10 to 12, 2026, the Liaoning Provincial Qualifying Round of the “Create and Win the Future” 2026 Entrepreneurship Competition was held in Tieling City, co-hosted by the Liaoning Provincial Department of Human Resources and Social Security, the Liaoning Provincial Department of Education, the Liaoning Provincial Department of Science and Technology, the Liaoning Provincial Department of Agriculture and Rural Affairs, and the Liaoning Provincial Department of Veterans Affairs. After three days of intense competition, Pengcheng Micro‑Nano Technology (Shenyang) Co., Ltd. (hereinafter referred to as “Pengcheng Micro‑Nano”) won first prize in the “Scientific and Technological Achievements + Entrepreneurship” track.

Professor Wu Xiangfang, Chairman of Pengcheng Semiconductor, has been appointed as a supervisor of the Guangdong Semiconductor Industry Association.

The 7th meeting of the 4th General Assembly and the leadership transition conference of Guangdong Semiconductor Industry Association concluded successfully in Shenzhen on the afternoon of May 16, 2026. Professor Wu Xiangfang, Chairman of Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd. (hereinafter referred to as Pengcheng Semiconductor), was officially appointed as Supervisor of Guangdong Semiconductor Industry Association.

Dalian, let’s meet—join Pengcheng Semiconductor at the 2026 Conference on Micro- and Nano‑Device and System Application Technologies.

In early summer, in May, a major event is just around the corner. From May 22 to 24, 2026, the 2026 Conference on Micro‑ and Nano‑Device and System Application Technologies, together with the 19th China Symposium on Micro‑ and Nanoelectronics, will be grandly held in the coastal city of Dalian. Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd. (hereinafter referred to as “Pengcheng Semiconductor”) will attend this conference.

High-Energy Pulsed Magnetron Sputtering Coating: The Indigenous Key to the Nanoscale World of Semiconductors

Did you know? One nanometer equals 10⁻⁹ meters—just one ten-thousandth the diameter of a human hair. The core chips in the smartphones, computers, and 5G devices we use every day harbor a “nanoscale world” even smaller than one ten-thousandth of a hair’s diameter: the realm of advanced-node semiconductors. Within these chips, insulating layers, barrier layers, and conductive films must all be “grown” with nanometer-level precision—this is precisely where high-power impulse magnetron sputtering (HiPIMS) coating technology comes into play.