Pengcheng Semiconductor will be exhibiting at the “2026 Second Glass Substrate and Optoelectronics Integration Technology Summit—From TGV Process to CPO Integration.”
Release time:
2026-04-24
The “2026 Second Glass Substrate and Optoelectronics Integration Technology Summit—From TGV Processes to CPO Integration” will be held from April 27 to April 28 at the Emperor Hotel in Songshan Lake, Dongguan. This summit brings together universities, research institutes, and companies across the industry chain to conduct in-depth discussions on advanced through-glass-via manufacturing processes, glass-substrate equipment, CPO integration design, and other key topics, making it a highly influential professional event in China’s TGV and CPO sectors.
As a high-tech enterprise specializing in semiconductor and broader semiconductor-related processes and equipment, Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd. (hereinafter referred to as “Pengcheng Semiconductor”) Will make its debut at this summit, engaging industry experts and partners in discussions on technology trends and showcasing domestically developed core equipment.
Core Equipment Showcase
Production-Grade TGV/TSV/TMV High-Vacuum Magnetron Sputtering Coating System (Sputter-2000W Series) ， This equipment is used for depositing a metal seed layer on high-density through-holes and blind holes in glass and ceramic substrates. Depth-to-diameter ratio > 10:1 For example, it is used in the substrate coating process for Cu/Ti microstructures and in the deposition of Au/TiW dual-system interconnect films, thereby supporting the enhancement of microsystem integration density.
Equipment advantages: excellent film uniformity and repeatability, strong film adhesion, and programmable automated control based on the process recipe.
Production-Grade TGV/TSV/TMV High-Vacuum Magnetron Sputtering Coating System
Currently, Moore’s Law is steadily approaching its physical limits, posing numerous challenges for conventional packaging and interconnect technologies. Glass substrates, with their low dielectric loss and high optical transparency, have emerged as the core platform for overcoming traditional packaging bottlenecks and enabling the practical implementation of CPO (Co-Packaged Optoelectronics) technology. Among these, TGV (Through-Glass Via) technology—key to achieving high-density vertical interconnections in glass substrates—plays a decisive role in determining chip integration density and performance. At this summit, Pengcheng Semiconductor looks forward to collaborating with you to explore the limitless possibilities of glass substrates and optoelectronic integration technologies. We warmly invite you to join us in Dongguan for meaningful exchanges and discussions on new opportunities in the industry!
Meeting Dates: April 27–28, 2026
Meeting Location: Emperor Hotel, Songshan Lake, Dongguan (No. 769, Meijing Middle Road, Dalang Town, Dongguan City)
Agenda:
About Us
Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd. was co-founded by Harbin Institute of Technology (Shenzhen) and a team of engineers with many years of practical experience. The company is positioned at the intersection of technological, market, and industrial frontiers, striving to drive innovation and sustainable development, address critical pain points in the industry and challenges related to domestic substitution, and achieve independent and controllable supply-chain capabilities.
Pengcheng Micro-Nano Technology (Shenyang) Co., Ltd. is a wholly owned subsidiary of Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd., serving as the design center and manufacturing base for semiconductor and broader semiconductor processes and equipment.
The company’s core business is micro- and nanotechnology combined with high-end precision manufacturing. Its specific application areas encompass the R&D and design, production and manufacturing, process technology services, and equipment upgrade and retrofitting of semiconductor and broader semiconductor materials, processes, and equipment. The company can provide process R&D and prototype fabrication for customers, supply production-grade equipment to manufacturing enterprises, and offer research-grade equipment for scientific research.
The company boasts a well-rounded talent pool, with engineers, Harbin Institute of Technology professors, and PhDs forming a core high-level team dedicated to materials research and process development. In addition, the company has a team of senior equipment designers from the industrial sector, bringing more than 30 years of experience in semiconductor materials research, epitaxy technology research, and the design, production, and manufacturing of complete sets of equipment for semiconductor thin-film deposition.
Leveraging its affiliation with Harbin Institute of Technology (Shenzhen), the company boasts state-of-the-art semiconductor R&D and testing infrastructure, enabling it to conduct cutting-edge research from a high starting point. Headquartered in Shenzhen, the company is equipped to undertake the R&D, manufacturing, and commissioning of semiconductor and broader semiconductor-related equipment, as well as pilot-scale production, full-scale manufacturing, and sales of semiconductor devices.
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