In early summer, in May, a grand event is just around the corner. From May 22 to 24, 2026, the 2026 Conference on Micro‑ and Nano‑Device and System Application Technologies, together with the 19th China Symposium on Micro‑ and Nanoelectronics, will be solemnly held in the coastal city of Dalian. Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd. (hereinafter referred to as “Pengcheng Semiconductor”) We will be attending this conference to join industry experts, scholars, and upstream and downstream partners in exploring new opportunities in micro‑ and nano‑devices, advanced packaging, and the localization of semiconductor equipment. Throughout the event, the Pengcheng Semiconductor technical team will be on site; you are warmly invited to stop by for discussions!

Pengcheng Semiconductor was co-founded by Harbin Institute of Technology (Shenzhen) and a team of engineers with many years of practical experience. The company is committed to the deep integration of micro‑ and nano‑technologies with high‑end precision manufacturing. Its applications span the research, design, production, and manufacturing of semiconductor and broader semiconductor‑related materials, processes, and equipment, as well as process‑technology services and the upgrading and retrofitting of manufacturing systems. It offers customers process R&D and prototyping services, provides production‑oriented equipment to manufacturers, and supplies research‑grade instruments to scientific institutions, thereby establishing an industry‑academia‑research integrated value chain.

At this exhibition, Pengcheng Semiconductor will showcase its flagship core products in the micro- and nano‑technology fields.

• Ultra-High Vacuum High-Energy Pulsed Magnetron Sputtering Coating System (HITSemi-UHV-HIPIMS)

In an ultra-clean environment, using nanometer and Atomic-level Manufacturing technology for growing high-purity, high-quality thin films. One of the application scenarios is: GaN single-crystal thin film Growth process, GaN-based diluted magnetic semiconductors Process implementation for the preparation of molecular-structure materials.

• Production‑type TGV/TSV/TMV high‑vacuum magnetron sputtering coating machine

This device is used for Glass substrate and Ceramic substrate of the High-density through-hole and Blind hole of the Metal seed layer deposition ， Depth-to-diameter ratio > 10:1 For example, it is used in the substrate coating process to deposit Cu/Ti microstructures and Au/TiW dual‑layer transmission‑line films, thereby supporting the enhancement of microsystem integration density.

• Production‑grade high‑vacuum magnetron sputtering/ion‑assisted/multi‑arc hybrid coating system

This equipment is widely used on the surfaces of milling cutters, drill bits, bearings, gears, lenses, and more. Hard wear-resistant coating Preparation, integrating workpiece surface treatment, ion cleaning, and particulate control, Magnetron sputtering 、 Ion-assisted coating and Reactive sputtering deposition A PVD system that integrates multiple processing methods.

• Production‑grade high‑vacuum magnetron sputtering and ion‑assisted composite coating system

This device employs Magnetron sputtering 、 Ion-assisted 、 Reactive sputtering This process method is used to deposit various thin-film materials on the surface of workpieces. The equipment is a PVD system that integrates multiple processes, including surface treatment, ion cleaning, particulate control, magnetron sputtering, ion-assisted deposition, and reactive sputter deposition.

• Research-grade high-vacuum magnetron sputtering coating system

This equipment is a high‑vacuum magnetron sputtering coating system designed for research and pilot‑scale applications, primarily used with substrates ranging from 2 to 12 inches. Circular-planar magnetron sputtering target and small Rectangular target Sputter coating is performed. It can be used to prepare metal, alloy, compound, semiconductor, ceramic, dielectric composite films, and other chemically reactive films; it is suitable for depositing various single-layer films, multilayer films, doped films, and alloy films; both magnetic and non-magnetic materials can be coated. It can be applied to… Advanced Packaging for TGV/TSV/TMV the research and development of, High aspect ratio (≥10:1) of the Deep-hole metal seed-layer coating 。

• HFCVD hot-filament chemical vapor deposition equipment

The equipment is primarily used for Micron crystal and Nanocrystalline diamond film Research and development as well as production. It can be used for the R&D and manufacturing of diamond products across mechanical, thermal, optical, and acoustic performance levels. It is capable of producing… Large-size polycrystalline diamond wafers , used for high-power devices, high-frequency devices, and high-power lasers Heat sink . Can be used in the production of corrosion-resistant and wear-resistant materials. Hard coating ; Diamond products for wastewater treatment in the environmental protection field. They can be used to prepare diamond thin films on planar workpieces, as well as to deposit diamond hard coatings on tool surfaces or other irregular surfaces. They can be used for… Thin-film solar cells Research and development, as well as production.

• High-vacuum electron-beam evaporation coating equipment

The equipment operates under high-vacuum conditions, utilizing Electron beam bombardment Materials Heating and evaporation The method involves depositing various metals, oxides, conductive films, optical films, semiconductor films, ferroelectric films, and ultra-hard films onto a substrate; it can also be used to deposit single-layer, multilayer, or doped composite films; and it is capable of depositing a wide range of materials. High-melting-point materials 。

• PECVD plasma-enhanced chemical vapor deposition equipment

The equipment is primarily used for operations conducted in a clean vacuum environment. Silicon nitride and Silicon dioxide of the Thin-film growth ; adopt Single-frequency or dual-frequency plasma-enhanced chemical vapor deposition technology It is an ideal process equipment for depositing high-quality silicon nitride, silicon oxide, and other thin films. The dual-frequency technology employs a 13.56 MHz RF power supply and a 400 kHz IF power supply. The RF power supply is used to regulate the plasma flux, while the IF power supply controls the plasma energy.

From May 22 to 24, meet in Dalian and join Pengcheng Semiconductor at the 2026 Conference on Micro‑ and Nano‑Device and System Application Technologies!

Meeting Map

Dalian Xiangzhou Garden Hotel (No. 171 Changchun Road, Xigang District, Dalian)