The Curtain Falls, Yet the Momentum Persists—Pioneering a Bright Future | Pengcheng Semiconductor Successfully Concludes the 2026 Second Glass Substrate and Optoelectronics Integration Technology Summit
Release time:
2026-04-29
The two-day “2026 Second Glass Substrate and Optoelectronic Integration Technology Summit—From TGV Process to CPO Integration” has successfully concluded in Dongguan. Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd. (hereinafter referred to as “ Pengcheng Semiconductor “As a company specializing in semiconductor and broader semiconductor-related processes and equipment, we showcased our core process equipment at Booth A6 and engaged in pragmatic technical exchanges and industry discussions with peers on topics such as glass substrates, TGV technology, and CPO integration.”
Centered on the theme “From TGV Technology to CPO Integration,” this summit focused on key industry topics such as glass substrates and AI computing power interconnectivity.
Pengcheng Semiconductor’s exhibit this time Production-grade TGV/TSV/TMV high-vacuum magnetron sputtering coating systems, is oriented towards Equipment for developing advanced packaging applications using glass and ceramic substrates. This equipment is specifically designed for plating metal seed layers in high-density through-hole and blind-via applications. Depth-to-diameter ratio > 10:1 It features high film uniformity and repeatability, as well as strong adhesion, providing reliable support for advanced packaging processes such as TGV/TSV and CPO optoelectronic integration.
Production-grade TGV/TSV/TMV high-vacuum magnetron sputtering coating system
During the exhibition, Pengcheng Semiconductor’s technical team engaged in in-depth discussions with attendees on equipment performance, TGV metallization yield, process compatibility, and production-line stability, carefully listening to users’ practical needs and feedback. These exchanges provided valuable insights and reference data for subsequent product optimization and process iteration.
Currently, glass substrates, as the next-generation chip substrates, are transitioning from the “technology validation” phase to the “eve of mass production.” Pengcheng Semiconductor will continue to deepen its expertise in core technologies such as magnetron sputtering deposition, steadily advancing product performance improvements and process optimization to meet the application requirements of packaging scenarios like TGV, thereby providing industry customers with stable, reliable, domestically produced equipment and services.
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