The 7th meeting of the 4th General Assembly and the leadership transition conference of Guangdong Semiconductor Industry Association concluded successfully in Shenzhen on the afternoon of May 16, 2026. Professor Wu Xiangfang, Chairman of Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd. (hereinafter referred to as Pengcheng Semiconductor), was officially appointed as Supervisor of Guangdong Semiconductor Industry Association.
2026/05/19
In early summer, in May, a major event is just around the corner. From May 22 to 24, 2026, the 2026 Conference on Micro‑ and Nano‑Device and System Application Technologies, together with the 19th China Symposium on Micro‑ and Nanoelectronics, will be grandly held in the coastal city of Dalian. Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd. (hereinafter referred to as “Pengcheng Semiconductor”) will attend this conference.
2026/05/16
The two-day “2026 Second Glass Substrate and Optoelectronics Integration Technology Summit—From TGV Process to CPO Integration” has successfully concluded in Dongguan.
2026/04/29
The “2026 Second Glass Substrate and Optoelectronics Integration Technology Summit—From TGV Process to CPO Integration” will be held from April 27 to April 28 at the Emperor Hotel in Songshan Lake, Dongguan.
2026/04/24
Technology empowers industries, and intelligent innovation leads the transformation of instrumentation. The 19th China Annual Conference on Scientific Instrument Development (ACCSI 2026), co-hosted by Instrument Information Network and the Management Committee of Zhongguancun Science City, will be grandly inaugurated in Beijing from April 22 to 24, 2026.
2026/04/20
From March 22 to 23, 2026, the 2026 China Advanced Semiconductor Packaging and Testing Conference (China International Semiconductor Packaging and Testing Conference) was successfully held at the GreenTree Holiday Hotel in Pudong, Shanghai. This premier industry event, centered on the development of the semiconductor packaging and testing sector, brought together leading companies across the entire value chain as well as distinguished experts and scholars to jointly explore innovative advancements in advanced packaging and testing technologies and pathways for industrial upgrading.
2026/03/28
With the rapid development of the semiconductor industry, especially in the field of chip interconnect technologies, through-glass vias (TGV) technology is increasingly becoming a key driver of growth. In the near future, this technology is expected to usher in unprecedented growth opportunities in both the global and Chinese markets. According to the latest market research data, China has already become the world’s largest market for TGV technology applications.
2026/02/03
In the ongoing evolution of modern medical imaging technology, magnetron sputtering has become a core process in the field of thin-film fabrication and is widely used in the manufacturing of critical components for medical imaging.
2026/01/28
Shenzhen—Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd. (hereinafter referred to as "Pengcheng Semiconductor"), which has been deeply engaged in the fields of advanced semiconductor packaging and micro- and nano-manufacturing, recently announced a significant technological breakthrough in its independently developed high-vacuum magnetron sputtering coating equipment. The equipment has successfully achieved high-density via plating with a depth-to-diameter ratio exceeding 10:1 in TGV (Through Glass Via) coating processes, injecting new momentum into the development of domestically produced vacuum coating equipment in the field of three-dimensional integration.
2026/01/16
Application of TGV Glass Through-Hole Technology in Magnetron Sputtering
As an advanced micro- and nano-fabrication technique, TGV glass via-hole technology has demonstrated tremendous application potential in the field of magnetron sputtering. By precisely fabricating vias on glass substrates, this technology not only enables vertical interconnections for three-dimensional circuits but also significantly enhances the integration and performance of electronic devices.
2026/01/05
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