Production-type TGV/TSV/TMV high-vacuum magnetron sputtering coating machine
Production-type TGV/TSV/TMV high-vacuum magnetron sputtering coating machine (Sputter-2000W series). This equipment is used for coating high-density through-holes and blind holes in glass and ceramic substrates, with an aspect ratio >10:1.
- Product Description
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Production TGV/TSV/TMV High Vacuum Magnetron Sputtering Coater (Sputter-2000W series) This equipment is used for coating high-density through-holes and blind holes on glass and ceramic substrates, with a depth-to-diameter ratio >10:1. For example: it provides support for increasing microsystem integration density by enabling the deposition of Cu/Ti microstructures and Au/TiW transmission line dual-system films for substrate coating processes.
Advantages of this equipment: high film uniformity and repeatability, strong film adhesion, and programmable automatic control based on process recipes.
Equipment Structure and Performance Parameters
- Single coating chamber, dual coating chamber, multi-chamber coating chamber
- Horizontal structure, vertical structure
- In-line type, cluster type
- Sample transfer: Linear, circular
- Number and type of magnetron sputtering targets: Multiple rectangular magnetron targets
- Magnetron sputtering targets: DC, RF, MF, high-energy pulse compatible
- Substrate can be heated, raised/lowered, and biased
- Reactive sputtering can be performed by introducing reactive gases
- Operation mode: Manual, semi-automatic, fully automatic
- Substrate holder: Configured according to substrate size
- Substrate size: 2, 4, 6, 8, 10 inches and customer-specified dimensions
- Ultimate vacuum of load-lock chamber: ≤8X10 -5 Pa
- Working background vacuum of load-lock chamber: ≤2X10 -3 Pa
- Ultimate vacuum of coating chamber: 5X10 -5 Pa,
Working background vacuum: 8X10 -4 Pa
- Film uniformity: <5% (intra-wafer), <5% (inter-wafer)
- Overall equipment leak rate: Vacuum ≤10Pa after 12 hours of shutdown
Operating ConditionsType Parameter Remarks Power Supply ～380V Three-phase five-wire system Power Configured according to equipment scale Cooling Water Circulation Configured according to equipment scale Water Pressure 1.0～1.5×10 5 Pa Cooling Capacity Configured according to heat dissipation Water Temperature 18～25℃ Pneumatic Component Gas Supply Pressure 0.5MPa～0.7MPa Mass Flow Controller Gas Supply Pressure 0.05MPa～0.2MPa Operating Ambient Temperature 10℃～40℃ Operating Ambient Humidity ≤50% 
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Contact: Miss Dai
Address: 1704, Building 1, Chongwen Park, Nanshan Zhiyuan, 3370 Liuxian Avenue, Nanshan District, Shenzhen City, Guangdong Province
Shenyang Office Address: Shenyang University Science Park, No.15 Wanghua South Street, Dadong District, Shenyang City, Liaoning Province
Telephone:13632750017
E-mail:sales@hitsemi.com
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