Micro nano technology and high-end precision manufacturing

Create greater value for customers

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Semiconductor field

Manufacturers of R & D, design and production of semiconductor materials, engineering and equipment

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Industrial/research grade thin film deposition equipment

R & D, design and production manufacturers of semiconductor materials and devices, micro-nano materials and devices, and advanced precision manufacturing technologies

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Development and production of micro-and nano-crystalline diamond films
Large-size diamond polycrystalline wafers for high-power devices,
Heat sink of high frequency device and high power laser

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Advanced semiconductor material supplier based on autonomous equipment

PECVD plasma enhanced chemical vapor deposition equipment is mainly used in
Thin film growth of silicon nitride and silicon oxide in clean vacuum environment

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Product

Total trip system

The whole equipment is a cluster structure, which is composed of photoelectric conversion film deposition system, MAMS electronic stripping system, exhaust packaging system, getter material vacuum coating system and overall degassing system. Can realize the overall automatic coordination operation, can also be independent operation of each system, do not interfere with each other, can be set between the system interlock. 316 material manufacturing, reserved a number of flange interface.

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Production-type TGV/TSV/TMV high-vacuum magnetron sputtering coating machine

Production-type TGV/TSV/TMV high-vacuum magnetron sputtering coating machine (Sputter-2000W series). This equipment is used for coating high-density through-holes and blind holes in glass and ceramic substrates, with an aspect ratio >10:1.

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MBE Molecular Beam Epitaxy Equipment

Molecular Beam Epitaxy (MBE) equipment can achieve epitaxial growth processes on certain substrates, enabling molecular self-assembly, superlattices, quantum wells, one-dimensional nanowires, and more. It can be used for process verification and the growth and manufacturing of epitaxial wafers for both second-generation and third-generation semiconductors. The MBE equipment provides an ultra-high vacuum environment during thin film epitaxial growth, creating an ideal setting for this process. It effectively eliminates various interference factors during film growth, resulting in high-precision thin films.

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HFCVD hot filament chemical vapor deposition equipment

Research and development design and manufacture of hot filament CVD diamond equipment, divided into experimental equipment and production equipment two categories. The equipment is mainly used for R & D and production of micro-crystalline and nano-crystalline diamond films. Can be used for mechanical level, thermal level, optical level, acoustic level of diamond products development and production. It can be used to manufacture large-size diamond polycrystalline wafers for high-power devices, high-frequency devices and heat sinks for high-power lasers.

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About Us

Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd.

By the Harbin Institute of Technology (Shenzhen) and has many years of practical experience in the team of engineers to jointly initiate the creation.


Based on the intersection of technology frontier and market frontier, the company seeks innovation and sustainable development, solves the pain points of the industry and the problem of localization, and strives for the independent control of the industrial chain. The company's core business is micro-nano technology and high-end precision manufacturing, specific application areas include semiconductor materials, semiconductor technology and semiconductor equipment research and development design and manufacturing. The company's talent team has a complete knowledge structure, including a high-level material research and process research team with professors and doctors of Harbin Institute of Technology as the core, and a team of senior equipment designers from the industry. they have more than 30 years of experience in semiconductor material research, epitaxial technology research and semiconductor film preparation equipment design, production and manufacturing. Relying on Harbin Institute of Technology (Shenzhen), the company has advanced semiconductor R & D equipment platform and testing equipment platform, and can carry out scientific research work from a high starting point. Headquartered in Shenzhen, the company has the ability to develop, produce and debug semiconductor equipment, as well as pilot, production and sales of semiconductor materials and devices.

Further understanding
2021 Year

Company establishment time

60 +

technology patent

30 Year

technology accumulation

200 +

Customer Service

Laboratory and R & D Center

Relying on the complete experimental platform and test analysis platform of Harbin Institute of Technology (Shenzhen), it provides support for R & D and production.

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News

The TGV glass through-hole technology has achieved a significant breakthrough, and its application prospects continue to expand.

2026-01-05

Recently, TGV (Through Glass Via) technology has made significant strides in the fields of materials processing and micro- and nano-manufacturing, drawing considerable attention from the semiconductor, advanced packaging, and emerging electronic device industries. With its outstanding electrical performance, high-frequency characteristics, and three-dimensional integration capabilities, TGV is emerging as one of the key technologies for next-generation high-density interconnects.

Application of TGV Glass Through-Hole Technology in Magnetron Sputtering

2026-01-05

As an advanced micro- and nano-fabrication technique, TGV glass via-hole technology has demonstrated tremendous application potential in the field of magnetron sputtering. By precisely fabricating vias on glass substrates, this technology not only enables vertical interconnections for three-dimensional circuits but also significantly enhances the integration and performance of electronic devices.

Diamond: Possessing potential that surpasses existing semiconductor materials, with broader application prospects in the future.

2025-12-16

Diamond is used as a semiconductor material—and some scholars even hail it as the “ultimate semiconductor material” and the “ultimate room-temperature quantum material”—owing to its unique physical and chemical properties. Diamond is an ultra-wide-bandgap semiconductor that boasts exceptional electrical, optical, mechanical, thermal, and chemical characteristics. These properties give diamond broad application prospects in numerous fields.

Pengcheng Semiconductor: The Strategy, Tactics, and Survival Guide of a High-Tech Enterprise

2025-11-11

The 15th China International Nanotechnology Industry Expo (referred to as "Nanobio"), held under much anticipation, successfully came to a close. This year's event featured one keynote speech, 15 parallel forums, and hosted 605 cutting-edge presentations. Additionally, it included an innovation and entrepreneurship competition, along with three supply-and-demand matchmaking sessions. The expo brought together over 150 nationally recognized talents and more than 500 top experts from leading universities, research institutions, and corporate organizations both domestically and internationally. With an exhibition area spanning 25,000 square meters, the event attracted over 350 of the world's premier companies and institutions, showcasing more than 2,400 of the latest nanotechnology products and innovative applications globally. Over the three-day period, the expo drew nearly 27,500 attendees in total, making it the largest-ever edition in terms of scale and cementing its growing influence on the global stage.