Exhibition Invitation丨Pengcheng Semiconductor sincerely invites you to attend the 2025 China Materials Congress!


Release time:

2025-07-01

The 2025 China Materials Congress will be held at the Xiamen International Convention and Exhibition Center in Fujian Province from July 5th to 8th, 2025. The congress is expected to attract 30,000 attendees and will feature 115 domestic and international sub-conferences covering five major themes: energy materials, environmental materials, advanced structural materials, functional materials, and materials design, preparation, and evaluation. A number of special forums will also be held, including a youth forum, a special new materials forum, a materials education forum, and a materials journal forum. In addition, an international new materials scientific research instrument and equipment exhibition will be held concurrently.

I. Conference Introduction

The "China Materials Congress 2025" will be held at the Xiamen International Convention and Exhibition Center in Fujian Province from July 5th to 8th, 2025. The conference is expected to attract 30,000 participants and will feature approximately 115 domestic and international sub-conferences covering five major themes: energy materials, environmental materials, advanced structural materials, functional materials, and material design, preparation, and evaluation. A series of special forums will also be held, including a youth forum, a special new materials forum, a materials education forum, and a materials journal forum. In addition, an international new materials scientific research instrument and equipment exhibition will be held concurrently.

II. Booth Information

Pengcheng Semiconductor Will bring technology based on nano and atomic manufacturing PVD/CVD for high-quality thin film preparation. For example, using magnetron sputtering technology for single-crystal thin film preparation, and using magnetron sputtering as a beam source for molecular beam epitaxy. Booth number: Hall C3, Booth C3094. Welcome to visit and exchange technology.

III. Featured Products

* Single-crystal thin film preparation using magnetron sputtering technology, and using magnetron sputtering as a beam source for molecular beam epitaxy

* Magnetron sputtering technology solves the problem of micro-hole coating with an aspect ratio higher than 10:1

* Large-size polycrystalline diamond wafers for use as heat sinks for high-power devices, high-frequency devices, and high-power lasers

* Using single-frequency or dual-frequency plasma-enhanced chemical vapor deposition technology, it is an ideal process equipment for depositing high-quality silicon nitride and silicon oxide thin films

Molecular Beam Epitaxy (MBE) thin film growth equipment

Production-type TGV/TSV/TMV high-vacuum magnetron sputtering coating machine

Production-type high-vacuum magnetron sputtering/ion-assisted/multi-arc composite coating machine

Production-type high-vacuum magnetron sputtering and ion-assisted composite coating machine

Research-type high-vacuum magnetron sputtering coating machine

HFCVD hot-wire chemical vapor deposition equipment

PECVD plasma-enhanced chemical vapor deposition equipment

IV. Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd.

Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd. was jointly founded by Harbin Institute of Technology (Shenzhen) and a team of engineers with many years of practical experience. The company is committed to innovation and sustainable development, addressing industry pain points and localization challenges, and striving for independent and controllable industrial chains.

Pengcheng Micro-Nano Technology (Shenyang) Co., Ltd. is a wholly-owned subsidiary of Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd., serving as the design center and production base for semiconductor processes and equipment.

The company's core business is micro-nano technology and high-end precision manufacturing, with specific applications including the R&D, design, production, manufacturing, and process technology services of semiconductor materials, semiconductor processes, and semiconductor equipment, as well as the upgrading and transformation of semiconductor equipment. It can provide process R&D and prototyping services for users.

The company's talent team has a complete knowledge structure, with a high-level materials research and process research team led by professors and doctors from Harbin Institute of Technology; and a senior equipment designer team from the industry, with over 20 years of experience in semiconductor materials research, epitaxial technology research, and the design, production, and manufacturing of complete sets of semiconductor thin film preparation equipment.

Relying on Harbin Institute of Technology (Shenzhen), the company has advanced semiconductor R&D equipment platforms and testing equipment platforms, enabling it to conduct research at a high starting point. The company's headquarters is located in Shenzhen, with the ability to conduct R&D, production, debugging of semiconductor equipment, and pilot testing, production, and sales of semiconductor materials and devices.

V. Convention Center Transportation Map

VI. Forum Activities

 

News Center

Pengcheng Semiconductor Leads the Future: Explosive Growth of TGV and TSV Technologies on the Horizon

With the rapid development of the semiconductor industry, especially in the field of chip interconnect technologies, through-glass vias (TGV) technology is increasingly becoming a key driver of growth. In the near future, this technology is expected to usher in unprecedented growth opportunities in both the global and Chinese markets. According to the latest market research data, China has already become the world’s largest market for TGV technology applications.

Application of Magnetron Sputtering Technology in the Preparation of Core Thin Films for Key Components in Medical Imaging

In the ongoing evolution of modern medical imaging technology, magnetron sputtering has become a core process in the field of thin-film fabrication and is widely used in the manufacturing of critical components for medical imaging.

Pengcheng Semiconductor Achieves a New Breakthrough in Magnetron Sputtering Technology, Boosting the Localization of High-End Vacuum Coating Equipment.

Shenzhen—Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd. (hereinafter referred to as "Pengcheng Semiconductor"), which has been deeply engaged in the fields of advanced semiconductor packaging and micro- and nano-manufacturing, recently announced a significant technological breakthrough in its independently developed high-vacuum magnetron sputtering coating equipment. The equipment has successfully achieved high-density via plating with a depth-to-diameter ratio exceeding 10:1 in TGV (Through Glass Via) coating processes, injecting new momentum into the development of domestically produced vacuum coating equipment in the field of three-dimensional integration.

Principles, Classification, and Applications of Physical Vapor Deposition (PVD) Technology

Physical Vapor Deposition (PVD) is an advanced surface engineering technology that, under vacuum conditions, uses physical methods to convert a target material into gaseous atoms, molecules, or ions, which then deposit onto the substrate surface to form a thin film. Since its development in the early 20th century, PVD technology has become a crucial technique in modern additive manufacturing and functional coating applications, owing to its advantages such as environmental friendliness, controllable costs, minimal consumable usage, dense and uniform film properties, and strong adhesion between the film and substrate. PVD enables the on-demand preparation of functional films with properties including wear resistance, corrosion resistance, conductivity, insulation, piezoelectricity, and magnetism, and is widely used across various industries, including mechanical, electronic, construction, and medical sectors.

The TGV glass through-hole technology has achieved a significant breakthrough, and its application prospects continue to expand.

Recently, TGV (Through Glass Via) technology has made significant strides in the fields of materials processing and micro- and nano-manufacturing, drawing considerable attention from the semiconductor, advanced packaging, and emerging electronic device industries. With its outstanding electrical performance, high-frequency characteristics, and three-dimensional integration capabilities, TGV is emerging as one of the key technologies for next-generation high-density interconnects.