Pengcheng Semiconductor Showcases Focus on 'Bottleneck' and 'Cutting-Edge' Fields - 2025 China Materials Conference-Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd.

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Pengcheng Semiconductor Showcases Focus on 'Bottleneck' and 'Cutting-Edge' Fields - 2025 China Materials Conference

Release time:

2025-06-24

“China Materials Congress 2025”: As a national academic brand conference in the field of new materials, it is oriented towards major national needs, bringing together the most authoritative experts and scholars and national strategic scientific and technological forces, focusing on key breakthroughs in “stuck neck” areas and “cutting-edge competition” areas, promoting high-end academic discussions, solving major common problems in industry development and major difficulties in the advancement of emerging industries, seizing the academic commanding heights of global new material development, forming a systematic national strategic layout, and building a solid material foundation and guarantee for promoting the construction of China's new productive forces.

“China Materials Congress 2025”: As a national-level academic brand conference in the field of new materials, it is oriented towards major national needs, bringing together the most authoritative experts and scholars and national strategic scientific and technological forces, focusing on key breakthroughs in "stuck neck" areas and "cutting-edge competition" areas, promoting high-end academic discussions, solving major common problems in industry development and major difficulties in the advancement of emerging industries, seizing the academic commanding heights of global new material development, forming a systematic national strategic layout, and building a solid material foundation and guarantee for promoting the construction of China's new productive forces.
“China Materials Congress 2025” will be held at the Xiamen International Convention and Exhibition Center in Fujian Province from July 5th to 8th.

At that time, Pengcheng Semiconductor will showcase its cutting-edge thin film deposition equipment and technical solutions at booth C3094. Based on PVD/CVD technology Magnetron sputtering technology for single-crystal thin film preparation, applying magnetron sputtering to Molecular Beam Epitaxy beam source, etc.

Vacuum coating technology is widely used in electronics, optical instruments, medical devices, new energy, lighting, automobiles, machinery, aerospace and many other fields. For example, in the electronics industry, vacuum coating technology is used to prepare semiconductor devices, microelectronic devices, reflective surfaces, insulating protective coatings, high-temperature sensors, etc. In addition, vacuum coating technology can also improve the physical and chemical properties and service life of the substrate, and has little environmental pollution.
Pengcheng Semiconductor mainly focuses on product improvement, optimization and iteration, improving technical barriers, and deeply exploring user needs to solve industry pain points; in product principle and method classification product coverage PVD Physical Vapor Deposition 、 CVD Chemical Vapor Deposition 、 Molecular Beam Epitaxy thin film growth equipment MBE 。
Pengcheng Semiconductor adopts a dual-drive model, with processes and equipment iterating and promoting each other, so that the materials produced by the equipment are optimized to a better level, improving competitiveness. More specifically: (1) Raising magnetron sputtering technology to an ultra-high vacuum level, using PVD technology to epitaxially grow gallium nitride single crystals in a super-clean background. (2) Including but not limited to solving Hot-wire CVD the problem of easy adhesion between hot wires when there are many hot wires, solving the problem of broken wires during long-term use, and developing a large-size polycrystalline diamond wafer growth process.
In short, Pengcheng Semiconductor will showcase its latest breakthroughs in "stuck neck" and "cutting-edge competition" areas at the China Materials Congress 2025. We look forward to exchanging and cooperating with industry colleagues to jointly promote the sustainable development of the semiconductor industry.

Production-type TGV/TSV/TMV high-vacuum magnetron sputtering coating machine

News Center

Pengcheng Semiconductor Leads the Future: Explosive Growth of TGV and TSV Technologies on the Horizon

With the rapid development of the semiconductor industry, especially in the field of chip interconnect technologies, through-glass vias (TGV) technology is increasingly becoming a key driver of growth. In the near future, this technology is expected to usher in unprecedented growth opportunities in both the global and Chinese markets. According to the latest market research data, China has already become the world’s largest market for TGV technology applications.

Application of Magnetron Sputtering Technology in the Preparation of Core Thin Films for Key Components in Medical Imaging

In the ongoing evolution of modern medical imaging technology, magnetron sputtering has become a core process in the field of thin-film fabrication and is widely used in the manufacturing of critical components for medical imaging.

Pengcheng Semiconductor Achieves a New Breakthrough in Magnetron Sputtering Technology, Boosting the Localization of High-End Vacuum Coating Equipment.

Shenzhen—Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd. (hereinafter referred to as "Pengcheng Semiconductor"), which has been deeply engaged in the fields of advanced semiconductor packaging and micro- and nano-manufacturing, recently announced a significant technological breakthrough in its independently developed high-vacuum magnetron sputtering coating equipment. The equipment has successfully achieved high-density via plating with a depth-to-diameter ratio exceeding 10:1 in TGV (Through Glass Via) coating processes, injecting new momentum into the development of domestically produced vacuum coating equipment in the field of three-dimensional integration.

Principles, Classification, and Applications of Physical Vapor Deposition (PVD) Technology

Physical Vapor Deposition (PVD) is an advanced surface engineering technology that, under vacuum conditions, uses physical methods to convert a target material into gaseous atoms, molecules, or ions, which then deposit onto the substrate surface to form a thin film. Since its development in the early 20th century, PVD technology has become a crucial technique in modern additive manufacturing and functional coating applications, owing to its advantages such as environmental friendliness, controllable costs, minimal consumable usage, dense and uniform film properties, and strong adhesion between the film and substrate. PVD enables the on-demand preparation of functional films with properties including wear resistance, corrosion resistance, conductivity, insulation, piezoelectricity, and magnetism, and is widely used across various industries, including mechanical, electronic, construction, and medical sectors.

The TGV glass through-hole technology has achieved a significant breakthrough, and its application prospects continue to expand.

Recently, TGV (Through Glass Via) technology has made significant strides in the fields of materials processing and micro- and nano-manufacturing, drawing considerable attention from the semiconductor, advanced packaging, and emerging electronic device industries. With its outstanding electrical performance, high-frequency characteristics, and three-dimensional integration capabilities, TGV is emerging as one of the key technologies for next-generation high-density interconnects.

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