Features and functional advantages of plasma coating instrument


Release time:

2024-08-12

Plasma coating instrument is a kind of surface treatment equipment, which has a wide range of applications and important functional advantages. It is mainly used for surface coating and modification treatment. By exposing the material to a plasma environment, the modification and coating of the material surface can be achieved by utilizing the mechanisms of ion bombardment and reactive deposition. This technology has a wide range of applications in various industries, such as electronics, optoelectronics, medical, automotive and other fields.

Plasma coating instrument is a kind of surface treatment equipment, which has a wide range of applications and important functional advantages. It is mainly used for surface coating and modification treatment. By exposing the material to a plasma environment, the modification and coating of the material surface can be achieved by utilizing the mechanisms of ion bombardment and reactive deposition. This technology has a wide range of applications in various industries, such as electronics, optoelectronics, medical, automotive and other fields.

Secondly, the plasma coating instrument has superior functional advantages. It can improve the performance of the material surface. By controlling the ion energy and flow rate in the plasma, the hardness, wear resistance and corrosion resistance of the material can be enhanced, thereby improving the service life and performance stability of the material. Nanoscale coating of the material surface can be achieved. By adjusting the composition of the reaction gas and the deposition conditions, a uniform and dense coating can be formed on the surface of the material, which has excellent optical, electrical and thermal properties. The surface composition of the material can also be adjusted. For example, in the field of optoelectronics, the performance of the semiconductor device can be adjusted by depositing a doped layer.
In addition, the plasma coating instrument also has the characteristics of high efficiency and environmental protection. Compared with the traditional coating technology, the plasma coating instrument can be used to treat the surface of the material at a lower temperature, reducing energy consumption and heat loss. At the same time, the technology does not require the use of harmful solvents and chemicals and is environmentally friendly.
Equipment Manufacturer-Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd
Disclaimer:
Part of this article is reproduced from the Internet, and its copyright and responsibility belong to the original author. If you are the original author and do not want to be reproduced, please contact us (sales@hitsemi.com).



News Center

TSV Technology: A Core Pillar of AI Computing Power

To establish a high‑bandwidth data‑transfer backbone for AI chips and sustain continuous gains in computing power, a fundamental underlying technology—TSV (Through‑Silicon Via)—is essential. TSV stands for Through‑Silicon Via, or silicon‑through‑via technology in Chinese. In essence, it creates vertical vias within a silicon wafer and fills them with conductive material, thereby forming a dense, vertically oriented electrical interconnect between the top and bottom surfaces of the wafer. This enables interchip connectivity and is one of the key enabling technologies for 2.5D and 3D packaging.

Warm congratulations to Pengcheng Micro‑Nano on winning the first prize in the Liaoning Province preliminary round of the “Innovate for the Future” 2026 Entrepreneurship Competition.

From June 10 to 12, 2026, the Liaoning Provincial Qualifying Round of the “Create and Win the Future” 2026 Entrepreneurship Competition was held in Tieling City, co-hosted by the Liaoning Provincial Department of Human Resources and Social Security, the Liaoning Provincial Department of Education, the Liaoning Provincial Department of Science and Technology, the Liaoning Provincial Department of Agriculture and Rural Affairs, and the Liaoning Provincial Department of Veterans Affairs. After three days of intense competition, Pengcheng Micro‑Nano Technology (Shenyang) Co., Ltd. (hereinafter referred to as “Pengcheng Micro‑Nano”) won first prize in the “Scientific and Technological Achievements + Entrepreneurship” track.

Professor Wu Xiangfang, Chairman of Pengcheng Semiconductor, has been appointed as a supervisor of the Guangdong Semiconductor Industry Association.

The 7th meeting of the 4th General Assembly and the leadership transition conference of Guangdong Semiconductor Industry Association concluded successfully in Shenzhen on the afternoon of May 16, 2026. Professor Wu Xiangfang, Chairman of Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd. (hereinafter referred to as Pengcheng Semiconductor), was officially appointed as Supervisor of Guangdong Semiconductor Industry Association.

Dalian, let’s meet—join Pengcheng Semiconductor at the 2026 Conference on Micro- and Nano‑Device and System Application Technologies.

In early summer, in May, a major event is just around the corner. From May 22 to 24, 2026, the 2026 Conference on Micro‑ and Nano‑Device and System Application Technologies, together with the 19th China Symposium on Micro‑ and Nanoelectronics, will be grandly held in the coastal city of Dalian. Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd. (hereinafter referred to as “Pengcheng Semiconductor”) will attend this conference.

High-Energy Pulsed Magnetron Sputtering Coating: The Indigenous Key to the Nanoscale World of Semiconductors

Did you know? One nanometer equals 10⁻⁹ meters—just one ten-thousandth the diameter of a human hair. The core chips in the smartphones, computers, and 5G devices we use every day harbor a “nanoscale world” even smaller than one ten-thousandth of a hair’s diameter: the realm of advanced-node semiconductors. Within these chips, insulating layers, barrier layers, and conductive films must all be “grown” with nanometer-level precision—this is precisely where high-power impulse magnetron sputtering (HiPIMS) coating technology comes into play.