Research-type high vacuum magnetron sputtering coating machineThe Circular Sputter series is our company's research and pilot high vacuum magnetron sputtering instrument, which mainly uses circular magnetron sputtering targets for sputtering methods to prepare metals, alloys, compounds, semiconductors, ceramics, dielectric composite films, and other chemical reaction films; suitable for coating various single-layer films, multi-layer films, doped films, and alloy films; can coat magnetic and non-magnetic materials.
Can be used for the research and development of advanced packaging for TGV/TSV/TMV, deep hole seed layer coating with a high aspect ratio (≥10:1).
Key technical features of the equipment
Adhering to the concept that equipment provides means for process realization, we have made the following designs and engineering implementations, which have shown good operational results, providing precise process equipment solutions for users' specialized process realizations.
Bonding treatment of the back of the target material and the surface of the sputtering target
- It is very difficult to achieve direct surface contact between the target material and the target surface. If surface contact cannot be achieved, the contact resistance will increase, leading to insufficient ionization electric field amplitude (increased contact resistance increases the electric field voltage drop at the contact surface), resulting in poor coating effects; increased resistance causes the target material to heat up, reducing coating quality.
- Poor contact between the target material and the target surface leads to poor water cooling effects, reducing coating quality.
- Adding a layer of special conductive and thermally conductive soft material to ensure surface contact.
Distance adjustable
The distance between the substrate and the target material can be adjusted to meet the distance requirements of different target materials for film formation processes.
Angle adjustable
The magnetron sputtering target head can be adjusted in angle to achieve precise control for uniformity concerning substrates of different sizes.
Integrated cabinet structure
Advantages of the integrated cabinet structure:
Good safety (operators will not touch high-voltage components and rotating parts)
Small footprint, dimensions approximately: length 1100mm × width 780mm (standard office door is 800mm wide) (traditional equipment is about 2200mm × 1000mm), the same area of working space can accommodate two devices.
Control system
Adopts a two-level control system of computer + PLC
Safety
- Detection and protection of the power system
- Set up vacuum detection and alarm protection functions
- Temperature detection and alarm protection
- Pressure detection and flow of the cooling circulating water system
- Detection and alarm protection
Uniform gas technology
The process gas uses uniform gas technology, resulting in a more uniform gas field and more uniform coating.
Substrate heating technology
Uses armored heating wires; since the electrically heated metal wires are not exposed in the vacuum chamber, they do not release impurities during the high-temperature heating process, ensuring the purity of the film. The armored heating wires are placed in a temperature equalizer to ensure uniform temperature, and then the substrate is heated.
Higher vacuum degree, faster pumping speed
The interior and exterior of the vacuum chamber are all electrochemically polished, completely removing surface microscopic burrs (visible under a microscope), with no places for microscopic dirt to hide, reducing the internal surface area of the chamber by more than half, resulting in purer coatings, higher vacuum degrees, and faster pumping speeds.
Equipment structure and performance:
1. Single coating chamber, double coating chamber, single coating chamber + sample chamber, coating chamber + glove box
2. Number and type of magnetron sputtering targets: 1 to 6 targets, circular flat targets
3. Installation positions of the targets: installed from bottom to top, from top to bottom, at an angle, or laterally
4. Magnetron sputtering targets: RF, medium frequency, DC pulse, DC compatible
5. Substrate can rotate, be heated, be lifted, and have bias voltage applied
6. Reactive gases can be introduced for reactive sputtering coating
7. Operating modes: manual, semi-automatic, fully automatic
8. If a higher base vacuum is required, a LOADLOCK must be configured, ultra-high vacuum magnetron sputtering targets, and sample transfer using a folding type, ultra-high vacuum robotic arm or vacuum robotic arm, with a system limit vacuum of up to 10-8Pa.
Main technical indicators of the equipment
- Substrate holder: configured according to the size of the supplied components.
- Substrate heater temperature: configured according to user supply requirements. Temperature can be controlled and adjusted via computer programming.
- Substrate automatic speed: 2~20 revolutions/minute.
- Substrate holder can be heated, rotated, and lifted.
- Distance from target surface to substrate adjustable from 30mm to 140mm.
- Φ2 to Φ12 inch flat circular targets, 1 to 6 pieces, equipped with a pneumatic target control panel, and the targets can be adjusted in angle.
- Limit vacuum of the coating chamber: 6X10-5Pa to 7X10-8Pa, recovery of working background vacuum 7×10-4Pa: about 30 minutes (new equipment filled with dry nitrogen gas)
- Overall leakage rate of the equipment: vacuum degree ≤5Pa after 12 hours of shutdown
Working conditions of the equipment