High Vacuum Electron Beam Evaporation Coating Machine
- Product Description
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High Vacuum Electron Beam Evaporation Coating Machine (PVD Coating Equipment)It uses the method of heating and evaporating materials by electron beam bombardment under high vacuum conditions to coat various metals, oxides, conductive films, optical films, semiconductor films, ferroelectric films, superhard films, etc. on the substrate; it can coat mixed single-layer films, multi-layer films, or doped films; it can coat various high melting point materials.
It can be used for production, scientific experiments, and teaching, and can be specially customized according to user requirements.
According to user requirements, it can be equipped with two options for automatic control of quartz crystal film thickness and optical film thickness, achieving full automatic control of the entire coating process through PLC and industrial computer, including vacuum system, baking system, evaporation process, and monitoring functions of film thickness, thereby improving work efficiency and ensuring consistency and stability of product quality.
Equipment Features
The equipment has the characteristics of high vacuum degree, fast pumping speed, and convenient substrate loading and unloading, equipped with E-type electron beam evaporation source and resistance evaporation source. PID automatic temperature control, with advantages of uniform film formation, low outgassing rate, and uniform temperature.
According to user requirements, it can be equipped with two options for automatic control of quartz crystal film thickness and optical film thickness, achieving full automatic control of the entire coating process through PLC and industrial computer, including vacuum system, baking system, evaporation process, and monitoring functions of film thickness, thereby improving work efficiency and ensuring consistency and stability of product quality.
Vacuum Performance
Ultimate vacuum: 7×10-5Pa～7×10-6Pa
Overall leakage rate of the equipment: 12 hours after shutdown, ≤10Pa
Short recovery time to working vacuum, from atmosphere to 7×10-4Pa≤30 minutes;
High Vacuum Electron Beam Evaporation Coating Machine (Electron Beam Evaporation Coating Machine) Equipment Composition
E-type electron beam evaporation gun, resistance thermal evaporation source component (optional), sample mask system, vacuum acquisition system and vacuum measurement system, molecular pump vacuum unit or cryopump vacuum unit, rotating substrate heating stage, working gas path, sample transfer mechanism, film thickness control system, electrical control system, constant temperature cooling water system, etc.
Optional: Film thickness monitoring instrument, constant temperature cooling water tank.Optional: Coating machine + glove box
Types and configurations of thermal evaporation sourcesProject
Parameters
Remarks
E-type electron beam evaporation system 1 set Power 6kW～10kW Others (can be configured according to user requirements) Crucible 1 to 8 pieces Can be configured according to user requirements Resistance thermal evaporation source component 1 to 4 sets (Can be configured according to user requirements) Types of resistance thermal evaporation sources
- Tantalum (tungsten or molybdenum) metal boat thermal evaporation source component
- Quartz boat thermal evaporation source component
- Tungsten electrode or tungsten blue thermal evaporation source component
- Tantalum furnace thermal evaporation source component (with boron nitride crucible or ceramic crucible)
- Beam source furnace thermal evaporation component (with quartz crucible or boron nitride crucible)
Operating Mode
Manual, semi-automatic
Research-type cabinet integrated high vacuum electron beam evaporation coating machine
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Contact: Miss Dai
Address: 1704, Building 1, Chongwen Park, Nanshan Zhiyuan, 3370 Liuxian Avenue, Nanshan District, Shenzhen City, Guangdong Province
Shenyang Office Address: Shenyang University Science Park, No.15 Wanghua South Street, Dadong District, Shenyang City, Liaoning Province
Telephone:13632750017
E-mail:sales@hitsemi.com
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