Production-grade high-vacuum magnetron sputtering/ion-assisted/multi-arc hybrid coating machine
Production-oriented high-vacuum magnetron sputtering/ion-assisted/multi-arc composite coating machine (PVD-1000S series): This equipment is widely used for preparing hard, wear-resistant coatings on surfaces of milling cutters, drill bits, bearings, gears, lenses, and other components. It is a PVD device that integrates multiple process technologies, including workpiece surface treatment, ion cleaning, particulate matter control, magnetron sputtering, ion-assisted coating, and reactive sputter deposition.
- Product Description
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Production-type High-Vacuum Magnetron Sputtering/Ion-Assisted/Multi-Arc Composite Coating Machine (PVD-1000S Series) This equipment is widely used for preparing hard, wear-resistant coatings on surfaces of milling cutters, drill bits, bearings, gears, lenses, and other components. It is a PVD device that integrates multiple process techniques, including workpiece surface treatment, ion cleaning, particulate matter control, magnetron sputtering, ion-assisted deposition, and reactive sputter coating.
It can be used to prepare single-layer films, multilayer films, doped films, metallic films and alloy films, as well as compound thin films.
Equipment Structure and Performance Parameters
The equipment consists of a PVD coating chamber, an integrated enclosed cabinet, a vacuum unit comprising a molecular pump and a rotary vane pump, a vacuum measurement system, a process gas piping system, a magnetron sputtering target, a linear ion source, a workpiece holder, a target shield, a workpiece rotation mechanism, a pulsed DC power supply, a high-energy pulse power supply, an intermediate-frequency power supply, an RF power supply, a bias power supply, an ion-assisted coating power supply and control system, a detection and alarm protection system, a water-cooling pipeline system, a circulating refrigeration constant-temperature water tank, and a two-level control system comprising a computer and a PLC.
- Overall machine dimensions: 2500mm × 2500mm × 2000mm. Custom dimensions are also available based on the user’s production capacity requirements.
- The magnetron sputtering target is rectangular, with a target surface dimension of 80 mm × 300 mm. It is arranged along the circumference of the vacuum chamber wall and allows for real-time adjustment of the distance between the target surface and the sample. The target head has a telescoping range of 150 mm.
- Different target sizes can also be configured according to the dimensions of the user’s workpiece.
- The linear ion source is arranged in two sets along the circumference of the vacuum chamber wall. The operating gas pressure ranges from 0.1 to 0.3 Pa, the energy is adjustable from 200 to 5000 eV, and the beam current intensity is between 0.2 and 1 A.
- The workpiece holder features a cylindrical structure, with workpieces arranged around the circumference. At each station, the workpieces both rotate on their own axes and revolve around a central axis. This design allows for a large number of samples to be loaded; the rotational motion is smooth and vibration-free, and the sealing is highly reliable.
- The workpiece can be biased.
- The heating system employs infrared heaters that produce no contamination in the vacuum environment and ensure uniform heating. An intelligent temperature controller with PID functionality regulates the heating power. The workpiece can be heated up to a maximum of 500 degrees Celsius.
Key Performance Parameters of the EquipmentUltimate vacuum degree 7×10 -5 Pa Work background vacuum degree 8×10 -4 Pa Work background vacuum arrival time <30 min (time required to pump from atmospheric pressure to the working vacuum level under conditions of air humidity below 45% and door-opening time <30 min) Hold pressure Shut down for 12 hours, pressure retention <10 Pa. Sputtering chamber external dimensions Diameter 875mm × Height 1000mm Overall machine dimensions 2500mm long × 2500mm wide × 2000mm high Sample heating temperature Room temperature ~ 500℃ Sample holder revolution speed 0; continuously adjustable from 3 to 12 rpm Intracardiac membrane layer uniformity <5% Uniformity of interlayer film <5% Number of magnetically controlled targets 4 targets (target positions can be expanded according to user processes) Linear ion source 2 targets Magnetic Control Target Specifications 80 mm × 300 mm. The target specifications can be configured according to the dimensions of the user’s workpiece. Target material specifications 80 mm × 100 mm × 8 mm. The target material specifications can be configured according to the dimensions of the user’s workpiece.
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Contact: Miss Dai
Address: 1704, Building 1, Chongwen Park, Nanshan Zhiyuan, 3370 Liuxian Avenue, Nanshan District, Shenzhen City, Guangdong Province
Shenyang Office Address: Shenyang University Science Park, No.15 Wanghua South Street, Dadong District, Shenyang City, Liaoning Province
Telephone:13632750017
E-mail:sales@hitsemi.com
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