Revival and Development of Vacuum Sputtering Coating


Release time:

2023-03-15

Sputtering is a phenomenon in which the surface of a solid (hereinafter referred to as a target) is bombarded with energy-charged particles (usually positive ions of an inert gas), thereby causing atoms (or molecules) on the surface of the target to escape from it. This phenomenon is Grove (Grove) in 1842 in the experimental study of cathode corrosion, the cathode material was migrated to the vacuum tube wall and found. The use of this sputtering method to deposit thin films on substrates was developed in 1877. However, there are a series of problems in the initial stage of depositing a thin film by this method, such as a low sputtering rate, a slow film-forming speed, and the necessity of setting a high pressure on the apparatus and passing an inert gas. As a result, slow development is nearly eliminated. Only in the chemically active precious metal refractory metals, media and compounds and other materials have been a small amount of application.

Sputtering is a phenomenon in which the surface of a solid (hereinafter referred to as a target) is bombarded with energy-charged particles (usually positive ions of an inert gas), thereby causing atoms (or molecules) on the surface of the target to escape from it. This phenomenon is Grove (Grove) in 1842 in the experimental study of cathode corrosion, the cathode material was migrated to the vacuum tube wall and found. The use of this sputtering method to deposit thin films on substrates was developed in 1877. However, there are a series of problems in the initial stage of depositing a thin film by this method, such as a low sputtering rate, a slow film-forming speed, and the necessity of setting a high pressure on the apparatus and passing an inert gas. As a result, slow development is nearly eliminated. Only in the chemically active precious metal refractory metals, media and compounds and other materials have been a small amount of application.
Until the 1970 s, due to the emergence of magnetron sputtering technology, sputtering coating has been rapid development, began to walk the road of revival. This is because the magnetron sputtering method can increase the probability of collision of electrons and gas molecules through the constraint of the orthogonal electromagnetic field, which not only reduces the voltage applied to the cathode, but also improves the sputtering rate of positive ions on the target cathode, reduces the shed rate of electron bombardment on the substrate, thus reducing its temperature. That is, it has the two characteristics of "high speed and low temperature.

 

In the 1980 s, although it appeared only a dozen years ago, it stood out from the laboratory and truly entered the field of large-scale industrial production. Moreover, with the further development of science and technology, ion beam enhanced sputtering has been introduced in the field of sputtering coating in recent years. A new sputtering mode is formed by using a wide beam and strong current ion source combined with magnetic field modulation and combining with regular two-pole sputtering. Moreover, the medium frequency AC power supply is introduced into the target source of the magnetron sputtering seal. This medium frequency AC magnetron sputtering technique, called twin target sputtering, not only eliminates the vanishing effect of the anode. Moreover, the poisoning problem of the cathode is also solved, thereby greatly improving the stability of magnetron sputtering. It provides a solid foundation for the industrial production of compound film preparation. In recent years, the revival and development of source coating has been active in the technical field of vacuum coating as a hot new thin film preparation technology.

 

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