Diamond heat dissipation wafer
With the rapid development of electronic information technology and micro-nano manufacturing technology, the feature size of electronic components is reduced to the micro-nanometer level, and the high integration and high power of electronic components make the heat dissipation problem known as the main bottleneck restricting the development of electronic devices. Therefore, the development of high-performance thermal management materials has become an important thrust for the development of electronic information industry. Diamond as a substrate for high-frequency high-power devices is an ideal choice for reducing thermal resistance.
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Contact: Miss Dai
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