High-Vacuum Resistive Thermal Evaporation Coating System HITSemi-PVD-420TE
The high-vacuum resistive thermal evaporation coating system employs resistive thermal evaporation technology. Under high-vacuum conditions, it deposits single‑layer or multi‑layer films of various compounds and mixtures onto a substrate by heating the material. It can be used for both physical and chemical research on materials. It is suitable for fabricating metal conductive electrodes, as well as for experiments investigating the physicochemical properties of organic materials, studies on the operating principles of organic semiconductor devices, OLED research and development, and experiments related to organic thin‑film solar cells.
- Product Description
-
The high-vacuum resistive thermal evaporation coating system employs resistive thermal evaporation technology. Under high-vacuum conditions, it deposits single‑layer or multilayer films of various compounds and mixtures onto substrates by heating the material.
It can be used for physical and chemical research on materials. It can be employed in the preparation of metal conductive electrodes; in experiments studying the physicochemical properties of organic materials, experiments exploring the principles of organic semiconductor devices, OLED research, and experiments on organic thin-film solar cells, among others.
Main Features
High vacuum level, fast pumping speed, and convenient substrate loading and unloading.
PID automatic temperature control ensures uniform film formation, minimal gas release, and even temperature distribution.Technical Parameters
Product Model HITSemi-PVD-420TE Substrate size 1" ~6" Resistive Thermal Evaporation Source 1–4 Resistive Thermal Evaporation Source Assembly Tantalum (tungsten or molybdenum) metal boat thermal evaporation source assembly
Quartz Boat Thermal Evaporation Source Assembly
Tungsten electrode or tungsten blue thermal evaporation source assembly
Tantalum furnace thermal evaporation source assembly (with boron nitride crucible or ceramic crucible)
Source Furnace Thermal Evaporation Assembly (with Quartz Crucible or Boron Nitride Crucible)Cavity material 304/316 (optional) stainless steel, electropolished Vacuum System Molecular pump + mechanical pump Ultimate vacuum 5×10 -5 Pa Restore work background vacuum Atmospheric up to 7×10 -4 Pa, about 30 minutes (new equipment is filled with dry nitrogen). Overall Device Leakage Rate Shut down for 12 hours with a vacuum level ≤ 8 Pa. Process Power Supply DC Steam Power Source, Beam Source Furnace Steam Power Source Substrate stage The substrate stage is capable of heating up to 600°C, rotating at 2–30 rpm, moving up and down, and being water‑cooled (optional). Film thickness uniformity Better than ±5% Control Form Semi-automatic / Fully automatic Plasma Cleaning Source Optional Film Thickness Monitoring Optional Constant-temperature chilled water tank Optional Air compressor Optional Operating Conditions of the Equipment
Power Supply Three-phase five-wire system, AC 380V, 50Hz; grounding resistance ≤ 1Ω. Power Configure according to the equipment scale, with a peak power of 10 kW to 20 kW. Cooling water ≤100 L/min Water pressure 0.1 MPa ~ 0.15 MPa Water temperature 18°C–25°C Pneumatic component supply pressure 0.5 MPa to 0.7 MPa Gas Supply Pressure for Mass Flow Controllers 0.05 MPa to 0.2 MPa Operating temperature 10°C–40°C Work environment humidity ≤50%
Key words:
Get Quote
Related Products
Contact: Miss Dai
Address: 1704, Building 1, Chongwen Park, Nanshan Zhiyuan, 3370 Liuxian Avenue, Nanshan District, Shenzhen City, Guangdong Province
Shenyang Office Address: Shenyang University Science Park, No.15 Wanghua South Street, Dadong District, Shenyang City, Liaoning Province
Telephone:13632750017
E-mail:sales@hitsemi.com
Message