Small HFCVD Hot‑Filament Chemical Vapor Deposition System HITSemi-HFCVD-X
Small HFCVD hot‑filament chemical vapor deposition equipment, primarily used for scientific research on micrometer‑ and nanometer‑grain diamond films. It can be applied to scientific research on diamond products of mechanical, thermal, optical, and acoustic grades.
- Product Description
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Small HFCVD hot‑filament chemical vapor deposition equipment, primarily used for scientific research on micrometer‑ and nanometer‑grain diamond films.
Scientific research on diamond products applicable to mechanical, thermal, optical, and acoustic grades.
Diamond polycrystalline wafers can be developed for use as heat sinks in high‑power devices, high‑frequency devices, and high‑power lasers.
Can be used for the research and development of anti-corrosion, wear‑resistant hard coatings; diamond products for wastewater treatment in the environmental protection field.
It can be used for the preparation of diamond films on flat workpieces, as well as for the deposition of diamond hard coatings on tool surfaces or other irregular surfaces.
Can be used for the research and development of solar thin-film batteries.
Key Features
The heating wire does not sag (solving the problem of heating wire sagging over long periods of heating).It can be single-sided coated or double-sided coated.
Device safety design, detection and protection of power systems, and the implementation of vacuum detection and alarm protection functions. Install water pressure detection and alarm protection devices, as well as pressure and flow detection and alarm protection for the cooling circulating water system.
Technical Parameters
Product Model HITSemi-HFCVD-X Substrate size Circle: Maximum φ550mm. Rectangle: Maximum 1200mm x 550mm. Heated Wire Power Supply Power Adjustable from 1 kW to 300 kW Cavity material 304/316 (optional) stainless steel, electropolished Vacuum chamber Double-layer water-cooling structure, vertical D‑shape with front and rear doors. Vacuum System Mechanical pump Ultimate vacuum 5×10 -1 Pa Heated wire material Tantalum wire or tungsten wire Heated wire temperature Adjustable from 1800℃ to 2500℃ Process Power Supply DC power supply Substrate stage Rotates at 0–3 revolutions per hour, is water‑cooled, supports optional bias voltage application, and is driven by a speed‑regulating motor. It can achieve automatic lifting and lowering, with the gap between the hot filament and the substrate adjustable within the range of 5 mm to 100 mm. The lifting and lowering process must be smooth, with vertical fluctuations no greater than 0.1 mm. Control Form Semi-automatic / Fully automatic Process gases (customizable) H 2 (5000 sccm, 100% concentration)
CH 4 (200 sccm, 100% concentration)
B 2 H 6 (50 sccm, H 2 Concentration: 99%)
Ar (1000 sccm, 100% concentration)Constant-temperature chilled water tank Optional Air compressor Optional Note: Does not include an exhaust gas treatment system. Operating Conditions of the Equipment
Power Supply Three-phase five‑wire system, AC 380V, 50Hz; grounding resistance ≤ 1Ω. Power Peak power (50 kW–300 kW), configured according to equipment scale. Cooling water ≤100 L/min Water pressure 0.1 MPa ~ 0.15 MPa Water temperature 18°C–25°C Pneumatic component supply pressure 0.5 MPa to 0.7 MPa Gas Supply Pressure for Mass Flow Controllers 0.05 MPa to 0.2 MPa Operating temperature 10°C–40°C Work environment humidity ≤50%
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