Inductor–Capacitor Hybrid 3D Plasma Cleaner HITSemi-Plasma-C
The inductor–capacitor hybrid three-dimensional plasma cleaner uses a high‑frequency plasma power supply to ionize gases under vacuum, generating highly active plasma. In low‑temperature environments—close to room temperature—the plasma emits a bluish‑purple glow (O₂ appears blue, while Ar glows deep purple). The high‑energy particles within the plasma induce physical sputtering and chemical reactions on the material surface, precisely achieving surface cleaning, activation, etching, and other modification effects, thereby imparting hydrophilic, hydrophobic, or low‑friction properties to the material. An intelligent control system and gas delivery system ensure process stability and make the equipment suitable for the efficient treatment of complex three‑dimensional structures.
- Product Description
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The inductor–capacitor–composite three-dimensional plasma cleaner uses a high‑frequency plasma power supply to ionize gases under vacuum, generating highly reactive plasma. In low‑temperature environments—close to room temperature—the plasma emits a bluish‑purple glow (O 2 It exhibits a blue color, with Ar appearing as a deep purple. Its high‑energy particles induce physical sputtering and chemical reactions on the material’s surface, precisely achieving surface cleaning, activation, etching, and other modification effects, thereby imparting hydrophilic, hydrophobic, or low‑friction properties to the material. The intelligent control system and gas delivery system ensure process stability and are well suited for the efficient treatment of complex three‑dimensional structures.
The plasma excitation method can be freely switched between capacitive and inductive modes.
Inductively and capacitively coupled three-dimensional plasma cleaners are widely used for surface activation and cleaning, etching, and photoresist removal. Through these processes, the wettability of material surfaces can be improved, enabling various materials to undergo coating, plating, and other operations, thereby enhancing adhesion and bonding strength while simultaneously removing organic contaminants, oil stains, or grease.
Key Features
- Efficient cleaning and deep activation
Comprehensive pollutant removal: A synergistic combination of physical bombardment and chemical decomposition effectively eliminates organic, inorganic, and particulate matter.
Deep Activation: Directionless plasma penetrates micropores and complex structures (such as threads and blind holes), enabling three-dimensional, uniform cleaning.
Enhanced Surface Performance: Micrometer‑scale roughening and grafting of –OH/–COOH groups can reduce the contact angle to as low as 10°, while adhesion is improved by more than 80%.
- Environmental Protection, Safety, and Low-Temperature Processes
Zero pollution emissions: Zero solvents throughout the entire process, no waste liquids or gases, compliant with RoHS standards, decomposing into CO. 2/H2 O and other harmless substances.
Low‑temperature process: Low‑temperature treatment (≤50°C) prevents damage to heat‑sensitive materials such as plastics and films.
- Cost-effective
Cost Reduction and Efficiency Enhancement: Each processing cycle takes only 3–10 minutes, consumes 30% of the energy used by conventional wet processes, and reduces maintenance costs by 40%.
- Intelligent Control and Process Flexibility
Intelligent Control: Precise matching of gas, electric field strength, and vacuum levels enables a single unit to seamlessly switch between multiple functions—cleaning, activation, and etching.Technical Parameters
Product Model HITSemi-Plasma-C Ion Source Power Power adjustable from 0 to 300W Ion Source Frequency 13.56 MHz Control Form Semi-automatic / Fully automatic Cleaning Time Adjustable from 1s to 9999s Working vacuum level 10 Pa ~ 500 Pa Ultimate vacuum degree 10⁻¹ Pa Vacuuming time ≤60s Vacuum Break Time ≤15s Overall Equipment Failure Rate Shut down for 12 hours with a vacuum level ≤ 20 Pa. Inner cavity Square cavity dimensions: 240 mm × 300 mm × 150 mm Quartz cavity: φ250mm × 400mm Cargo tray Number of electrode plates: 3 layers (single-layer electrode plates can be adjusted for testing). Payload electrode plate dimensions: 230 mm × 220 mm Electrode fixing method: Plug‑and‑play, detachable. Pallet storage height: Adjustable from 15 mm to 55 mm. Process gas Route 4 (N 2 , Ar, O 2 , H 2 Optional) Control System PLC + Touch Screen Operating Conditions of the Equipment
Power Supply AC 220V (±10V) 50/60Hz Power 3 kW Cooling water ≤100 L/min Pneumatic component supply pressure 0.5 MPa to 0.7 MPa Gas Supply Pressure for Mass Flow Controllers 0.05 MPa to 0.2 MPa Operating temperature 10°C–40°C Work environment humidity ≤50%
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