Small Plasma Cleaner (Capacitive) HITSemi-Plasma-C1
The energy of the electric field is used to excite and sustain the plasma. A high‑frequency alternating voltage is applied across parallel electrode plates. The powerful alternating electric field accelerates free electrons in the reaction gas; these high‑energy electrons collide with gas molecules, causing them to ionize and decompose, thereby forming plasma.
- Product Description
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The energy of the electric field is used to excite and sustain the plasma. A high‑frequency alternating voltage is applied across parallel electrode plates. The powerful alternating electric field accelerates free electrons in the reaction gas; these high‑energy electrons collide with gas molecules, causing ionization and decomposition, thereby forming plasma.
Ions exhibit strong directional properties and high energy, making them highly effective at removing stubborn contaminants such as grease and fingerprints, as well as in surface etching and roughening. They are suitable for cleaning planar substrates.
Main Features
Miniaturization facilitates laboratory operations and use while significantly reducing experimental costs.
Strong physical sputtering capability. Suitable for removing stubborn contaminants.Technical Parameters
Product Model HITSemi-Plasma-C1 Plasma Source Power 300W (continuously adjustable from 60% to 100%) Plasma Source Frequency 40KHz/13.56MHz Control Form Semi-automatic / Fully automatic Cleaning Time Adjustable from 1s to 9999s Vacuum degree <80 Pa Vacuum pump Pumping speed: 2 L/s (oil mist filtration) Inner cavity (circular) Dimensions: φ150mm × 280mm
Material: 316 Stainless SteelEffective Space Management 130mm × 245mm Processing temperature <60° Electrode Layout Parallel electrode plates: Power plate (1) + stainless steel tray (1) Process gas Route 2 (N 2 , Ar, O 2 , H 2 Optional) Control System PLC + Touch Screen Operating Conditions of the Equipment
Power Supply AC 220V (±10V) 50/60Hz Power 1.5KW Operating temperature 10°C–40°C Work environment humidity ≤50%
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