Typhoon Information | HFCVD — Large-Scale Diamond Film Deposition


Release time:

2026-07-22

Large‑size diamond films are pivotal for scaling up industrial applications, and the HFCVD hot‑filament chemical vapor deposition technique currently represents the most mainstream and efficient industrial approach for fabricating such films.

In fields such as semiconductor thermal management, precision manufacturing, and high-end laser technology, diamond films have become indispensable functional materials thanks to their outstanding properties, including high thermal conductivity, wear resistance, corrosion resistance, and electrochemical stability. Among these, large‑size diamond films are pivotal for enabling scalable industrial applications, while… HFCVD hot-filament chemical vapor deposition technology , which is currently the most mainstream and efficient industrial-scale approach for preparing large‑size diamond films.

Why are large‑size diamond films the key to achieving large‑scale industrial applications?

Natural diamonds are scarce, extremely small in size, and contain uncontrollable impurities, making them unsuitable for large-scale industrial applications. In contrast, artificially synthesized large‑size diamond films, with their comprehensive performance advantages, can readily meet the demands of industrial mass production:

High thermal conductivity Its thermal conductivity far exceeds that of metals such as copper and silver, making it a core heat‑dissipation substrate for third‑generation semiconductor power devices and RF chips, effectively addressing the thermal‑failure challenges associated with highly integrated, high‑heat‑flux devices.

Ultra‑durable wear protection It boasts ultra-high hardness and, for high-temperature‑resistant substrates or components designed with special transition layers, can deposit a protective coating on the surfaces of precision mechanical parts, enhancing wear resistance and service life while reducing manufacturing costs.

Excellent electrochemical properties : Boron-doped diamond films can be used to fabricate BDD electrode It can efficiently treat industrial wastewater that is high in salinity, highly toxic, and difficult to biodegrade, while being environmentally friendly and generating no secondary pollution.

High-quality optical performance : High light transmittance, laser‑damage resistance, and excellent thermal‑deformation stability; suitable for high‑power laser windows, infrared optical components, and other applications.

Why is HFCVD the core technology for depositing large‑size diamond films?

HFCVD (Hot Filament Chemical Vapor Deposition) It is currently the mainstream process for industrial-scale mass production, with its core principle being the provision of a stable, controllable thin-film growth environment to deposit and grow high-quality diamond films on various substrate surfaces. This type of equipment features a robust structure, exceptional scalability, and excellent film uniformity, enabling seamless deposition of large‑area, full‑wafer diamond films.

The basic principle is as follows:

1. After evacuating the chamber to the base vacuum, a precisely controlled gas mixture—typically a carbon source gas such as methane (CH₄)—is introduced. 4 ) and excess hydrogen gas (H 2 A mixture of ) is introduced into the chamber at low pressure, establishing a clean, low-pressure reaction environment.

2. The dedicated heating filament inside the chamber is typically heated to temperatures exceeding 2,000°C to pyrolyze the mixed process gases.

3. Gas-phase pyrolysis generates reactive carbon atomic groups, which nucleate and grow into diamond grains on substrates such as silicon and molybdenum.

4. Atomic hydrogen selectively etches away graphite impurities formed during the growth process, ensuring film purity and ultimately yielding a uniform, dense, large‑area polycrystalline diamond film on the substrate surface.

Pengcheng Semiconductor HFCVD Hot-Wire Chemical Vapor Deposition Equipment

Leveraging the deep technical expertise of the Harbin Institute of Technology (Shenzhen) core team, Pengcheng Semiconductor focuses on the iterative advancement and upgrading of domestically produced HFCVD equipment. By addressing key industry challenges—such as non-uniform film deposition, short filament lifetimes, and limited production‑scale dimensions—it delivers end-to-end equipment‑plus‑process solutions to its customers.

HFCVD hot-filament chemical vapor deposition equipment

The equipment supports the deposition of large‑size circular and rectangular substrates, enabling stable preparation of 2–8‑inch diamond films, and has already achieved… 12 inches A groundbreaking breakthrough in ultra-large-format printing, The heated wire doesn’t sag at the waist. , meeting the mass-production dimensional requirements of sectors such as semiconductors, optics, precision manufacturing, and environmental protection.

Diamond wafers under an electron microscope

The large-scale application of high‑quality diamond films marks a significant milestone in the domestic upgrading of China’s semiconductor‑related industries, with HFCVD equipment serving as the linchpin that bridges the upstream segment of the supply chain. Moving forward, Pengcheng Semiconductor will continue to deepen its expertise in HFCVD thin‑film deposition systems, relentlessly refining processes for depositing large‑area diamond films. By providing cutting‑edge, domestically developed equipment, the company aims to empower both upstream and downstream partners and drive the high‑quality development of the diamond‑based functional materials sector.

News Center

Typhoon Information | HFCVD — Large-Scale Diamond Film Deposition

Large‑size diamond films are pivotal for scaling up industrial applications, and the HFCVD hot‑filament chemical vapor deposition technique currently represents the most mainstream and efficient industrial approach for fabricating such films.

TSV Technology: A Core Pillar of AI Computing Power

To establish a high‑bandwidth data‑transfer backbone for AI chips and sustain continuous gains in computing power, a fundamental underlying technology—TSV (Through‑Silicon Via)—is essential. TSV stands for Through‑Silicon Via, or silicon‑through‑via technology in Chinese. In essence, it creates vertical vias within a silicon wafer and fills them with conductive material, thereby forming a dense, vertically oriented electrical interconnect between the top and bottom surfaces of the wafer. This enables interchip connectivity and is one of the key enabling technologies for 2.5D and 3D packaging.

Warm congratulations to Pengcheng Micro‑Nano on winning the first prize in the Liaoning Province preliminary round of the “Innovate for the Future” 2026 Entrepreneurship Competition.

From June 10 to 12, 2026, the Liaoning Provincial Qualifying Round of the “Create and Win the Future” 2026 Entrepreneurship Competition was held in Tieling City, co-hosted by the Liaoning Provincial Department of Human Resources and Social Security, the Liaoning Provincial Department of Education, the Liaoning Provincial Department of Science and Technology, the Liaoning Provincial Department of Agriculture and Rural Affairs, and the Liaoning Provincial Department of Veterans Affairs. After three days of intense competition, Pengcheng Micro‑Nano Technology (Shenyang) Co., Ltd. (hereinafter referred to as “Pengcheng Micro‑Nano”) won first prize in the “Scientific and Technological Achievements + Entrepreneurship” track.

Professor Wu Xiangfang, Chairman of Pengcheng Semiconductor, has been appointed as a supervisor of the Guangdong Semiconductor Industry Association.

The 7th meeting of the 4th General Assembly and the leadership transition conference of Guangdong Semiconductor Industry Association concluded successfully in Shenzhen on the afternoon of May 16, 2026. Professor Wu Xiangfang, Chairman of Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd. (hereinafter referred to as Pengcheng Semiconductor), was officially appointed as Supervisor of Guangdong Semiconductor Industry Association.

Dalian, let’s meet—join Pengcheng Semiconductor at the 2026 Conference on Micro- and Nano‑Device and System Application Technologies.

In early summer, in May, a major event is just around the corner. From May 22 to 24, 2026, the 2026 Conference on Micro‑ and Nano‑Device and System Application Technologies, together with the 19th China Symposium on Micro‑ and Nanoelectronics, will be grandly held in the coastal city of Dalian. Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd. (hereinafter referred to as “Pengcheng Semiconductor”) will attend this conference.