Pengcheng Semiconductor-High-end Semiconductor Epitaxial Equipment Appears in 2022 "Core Power" Competition-Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd.

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Pengcheng Semiconductor-High-end Semiconductor Epitaxial Equipment Appears in 2022 "Core Power" Competition

Release time:

2022-04-18

The seventh round of the core power preliminary competition will be officially launched on April 20, focusing on the four popular tracks of BAW filter, analog chip, epitaxial equipment and photoelectric detector. These tracks not only have broad prospects, but also are important tracks that need to be localized. This Pengcheng Semiconductor was invited to "high-end semiconductor epitaxial equipment" as the theme of the appearance of this competition.
Pengcheng Semiconductor has advanced semiconductor research and development equipment platform and testing equipment platform, in a high starting point to carry out scientific research work, aimed at solving the current situation of semiconductor equipment manufacturing card neck, to help the development of the national semiconductor industry.

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The 27th CIOE China Optoelectronics Expo is set to open, as we join Shenzhen Semiconductor in embarking on a new journey in micro- and nano-manufacturing.

From September 9 to 11, 2026, the 27th CIOE China Optics Expo will open with great fanfare! Pengcheng Semiconductor will showcase its self-developed vacuum thin-film equipment—covering magnetron sputtering, electron-beam evaporation, HFCVD diamond deposition—and comprehensive process solutions at the Shenzhen Bao’an Convention & Exhibition Center. Focusing on advanced packaging, precision optics, and optoelectronic manufacturing, we warmly invite industry peers to visit, engage in discussions, and explore new opportunities together!

Pengcheng Semiconductor Exhibition Highlights | The 8th Precision Ceramics Industry Chain Exhibition

From August 26 to 28, 2026, the three-day 8th Precision Ceramics Industry Chain Exhibition successfully concluded at Hall 7 of the Shenzhen International Convention and Exhibition Center (Bao’an New Venue). Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd. (hereinafter referred to as “Pengcheng Semiconductor”) showcased diamond‑based thermal‑dissipation wafers along with its core coating equipment—PVD coating systems and CVD coating systems—at Booth H20.

Pengcheng Semiconductor invites you to join the 8th Precision Ceramics Industry Chain Exhibition and attend this premier event showcasing cutting-edge packaging technologies.

From August 26 to 28, 2026, the 8th Precision Ceramics Industry Chain Exhibition will grandly open in Hall 7 of the Shenzhen International Convention and Exhibition Center (Bao’an New Venue). Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd. (hereinafter referred to as “Pengcheng Semiconductor”) will be showcasing at this event and participating in the concurrently held 4th Glass Substrate and Advanced Packaging Industry Chain Summit Forum. We cordially invite customers and industry peers to attend, engage in discussions, and jointly explore new opportunities for technological advancement in the sector.

Pengcheng Micro-Nano was awarded third prize in the national finals of the “Innovate for the Future” Entrepreneurship Competition.

Recently, the national finals of the “Create and Win the Future” entrepreneurship competition, co-hosted by the Ministry of Human Resources and Social Security and the People’s Government of Anhui Province, concluded in Hefei. Pengcheng Micro‑Nano Technology (Shenyang) Co., Ltd. (hereinafter referred to as “Pengcheng Micro‑Nano”) won third prize in the “Scientific and Technological Achievements + Entrepreneurship Track” category of the national finals, thanks to its project on a tunnel‑type continuous high‑vacuum magnetron sputtering coating and encapsulation system. The company has thus successfully completed the full competition journey, advancing from the provincial qualifiers to the national stage.

Typhoon Information | HFCVD — Large-Scale Diamond Film Deposition

Large‑size diamond films are pivotal for scaling up industrial applications, and the HFCVD hot‑filament chemical vapor deposition technique currently represents the most mainstream and efficient industrial approach for fabricating such films.

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