As a premier semiconductor industry event rooted in the Guangdong-Hong Kong-Macao Greater Bay Area and oriented toward the global market, Bay Area Semiconductor Industry Ecosystem Expo (abbreviated as “ Bay Chip Exhibition WESEMiBAY will be held from October 14 to 16, 2026 in Shenzhen Convention & Exhibition Center (Futian) A major launch is underway. Pengcheng Semiconductor Technology (Shenzhen) Co., Ltd. (hereinafter referred to as “…”) Pengcheng Semiconductor ”) will bring Large-Scale Diamond Film Preparation Equipment 、 Gallium Nitride (GaN) Single-Crystal Thin-Film Growth Equipment The core equipment will be unveiled. Hall 5, Booth 5G07 Booth.

Exhibition Overview

The Bay Area Chip Expo, under the theme “Chips Usher in the Future, Intelligence Creates an Ecosystem,” focuses on the collaborative development of the entire semiconductor industry chain. It brings together over 800 world-class semiconductor companies, spanning key areas such as wafer fabrication equipment, components, materials, advanced packaging, IC design, and third-generation semiconductors. Complemented by more than 40 technical forums, the event establishes an industrial ecosystem platform that integrates technology exchange, supply‑demand matchmaking, and industry empowerment.

Display of Selected Core Equipment

Ultra-High Vacuum High-Energy Pulsed Magnetron Sputtering Coating System (HITSemi-UHV-HIPIMS)

In an ultra-clean environment, using nanometer and Atomic-level Manufacturing technology for growing high-purity, high-quality thin films. One of the application scenarios is: GaN single-crystal thin film Growth process, GaN-based diluted magnetic semiconductors Process implementation for the preparation of molecular-structure materials.

The equipment comprises a process chamber, a pre‑treatment chamber, a glove box, a sample transfer system, a vacuum deposition system, an electrical control system, and RHEED‑based measurement and characterization systems. It enables the entire workflow—sample cleaning, epitaxial wafer and diluted magnetic semiconductor film deposition, post‑deposition processing, and protective packaging—to be carried out in a cleanroom environment.

Key Features

The plasma sputter epitaxy process is carried out under ultra-high vacuum and ultra-clean conditions.

An electron-beam-based testing approach integrating atomic‑scale probing enables the investigation of ultra‑high‑vacuum PSD epitaxial materials at the atomic level, encompassing the mechanisms and kinetics of atomic‑scale defect formation.

From Atomic scale Precise control Third-generation semiconductors (This project is based on GaN thin film Performing verification of the plasma sputter epitaxial growth process.

Production‑type TGV/TSV/TMV high‑vacuum magnetron sputtering coating machine

This device is used for Glass substrate and Ceramic substrate of High-Density Through-Hole and Blind hole of Metal seed layer coating ， Depth-to-diameter ratio > 10:1 For example, it is used in the substrate coating process to deposit Cu/Ti microstructures and Au/TiW dual‑layer transmission‑line films, thereby supporting the enhancement of microsystem integration density.

Advantages of this equipment: excellent film uniformity and repeatability, strong film adhesion, and programmable automated control tailored to the process recipe.

Production‑grade high‑vacuum magnetron sputtering/ion‑assisted/multi‑arc hybrid coating system

This equipment is widely used on the surfaces of milling cutters, drill bits, bearings, gears, lenses, and more. Hard wear-resistant coating Preparation, integrating workpiece surface treatment, ion cleaning, and particulate control, Magnetron sputtering 、 Ion-assisted coating and Reactive sputtering deposition A PVD system that integrates multiple deposition techniques. It can fabricate single-layer films, multilayer films, doped films, metallic films, alloy films, and compound thin films, among others.

HFCVD hot-filament chemical vapor deposition equipment

The equipment is primarily used for Micron crystal and Nanocrystalline diamond film Research and development as well as production. It can be used for the R&D and manufacturing of diamond products across mechanical, thermal, optical, and acoustic performance levels. It is capable of producing… Large-size polycrystalline diamond wafers , used for high-power devices, high-frequency devices, and high-power lasers Heat sink . Can be used in the production of corrosion-resistant and wear-resistant materials. Hard coating ; Diamond products for wastewater treatment in the environmental protection field. They can be used to prepare diamond thin films on planar workpieces, as well as to deposit diamond hard coatings on cutting tool surfaces or other irregular surfaces. They can be used for… Solar thin-film battery Research and development, as well as production.

Research-grade high-vacuum magnetron sputtering coating system

This equipment is a high‑vacuum magnetron sputtering coating system designed for research and pilot‑scale applications, primarily used with substrates ranging from 2 to 12 inches. Circular-planar magnetron sputtering target and small Rectangular target Sputter coating is performed. It can be used to prepare metal, alloy, compound, semiconductor, ceramic, dielectric composite films, and other chemically reactive films; it is suitable for depositing various single-layer films, multilayer films, doped films, and alloy films; both magnetic and non-magnetic materials can be coated. It can be applied to… Advanced Packaging for TGV/TSV/TMV the research and development of, High aspect ratio (≥10:1) of Deep-hole metal seed-layer coating 。

High-vacuum electron-beam evaporation coating machine

Under high-vacuum conditions, using Electron-beam bombardment of the material induces heating and evaporation. The method involves depositing various metals, oxides, conductive films, optical films, semiconductor films, ferroelectric films, and ultra-hard films onto a substrate; it can also be used to deposit single-layer, multilayer, or doped composite films; and it is capable of coating a wide range of materials. High-melting-point materials The equipment features high vacuum levels, rapid pumping speeds, and convenient substrate loading and unloading, and is equipped with an E-type… Electron-beam evaporation source and Resistance evaporation source 。 PID It features automatic temperature control and offers the advantages of uniform film formation, low outgassing, and even temperature distribution.

Exhibition Guide

Exhibition Dates: October 14–16, 2026

Exhibition Venue: Shenzhen Convention & Exhibition Center (Futian)

Booth No.: Hall 5, 5G07

Pengcheng Semiconductor cordially invites industry peers and partners from home and abroad to visit our booth for in-depth, face-to-face discussions, jointly exploring new opportunities in China’s semiconductor sector and co‑building a thriving new ecosystem for industrial development!